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P87C660X2BBD PDF预览

P87C660X2BBD

更新时间: 2024-11-07 04:35:15
品牌 Logo 应用领域
恩智浦 - NXP 微控制器和处理器外围集成电路可编程只读存储器时钟
页数 文件大小 规格书
102页 563K
描述
80C51 8-bit microcontroller family

P87C660X2BBD 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFP
包装说明:10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-389-1, LQFP-44针数:44
Reach Compliance Code:unknownECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.83
Is Samacsys:N具有ADC:NO
其他特性:OPERATES AT 2.7 V MINIMUM SUPPLY @ 16 MHZ地址总线宽度:16
位大小:8CPU系列:8051
最大时钟频率:33 MHzDAC 通道:NO
DMA 通道:NO外部数据总线宽度:8
JESD-30 代码:S-PQFP-G44JESD-609代码:e3
长度:10 mm湿度敏感等级:1
I/O 线路数量:32端子数量:44
最高工作温度:70 °C最低工作温度:
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装等效代码:QFP44,.5SQ,32
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE
峰值回流温度(摄氏度):260电源:3/5 V
认证状态:Not QualifiedRAM(字节):512
ROM(单词):16384ROM可编程性:OTPROM
座面最大高度:1.6 mm速度:33 MHz
子类别:Microcontrollers最大压摆率:0.03 mA
最大供电电压:5.5 V最小供电电压:4.5 V
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin (Sn)端子形式:GULL WING
端子节距:0.8 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:10 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

P87C660X2BBD 数据手册

 浏览型号P87C660X2BBD的Datasheet PDF文件第3页浏览型号P87C660X2BBD的Datasheet PDF文件第4页浏览型号P87C660X2BBD的Datasheet PDF文件第5页浏览型号P87C660X2BBD的Datasheet PDF文件第7页浏览型号P87C660X2BBD的Datasheet PDF文件第8页浏览型号P87C660X2BBD的Datasheet PDF文件第9页 
Philips Semiconductors  
Product data  
80C51 8-bit microcontroller family 16 KB OTP/ROM, 512B  
RAM, low voltage (2.7 to 5.5 V), low power, high speed (30/33  
MHz), two 400KB I2C interfaces  
P8xC660X2/661X2  
LOGIC SYMBOL  
Plastic Quad Flat Pack  
44  
34  
V
V
SS  
CC  
XTAL1  
1
33  
ADDRESS AND  
DATA BUS  
P8xC660X2/661X2  
XTAL2  
RST  
11  
23  
T2  
T2EX  
CEX0  
CEX1  
CEX2  
SCL0  
SDA0  
SCL1  
SDA1  
EA/V  
PP  
12  
Pin Function  
22  
PSEN  
Pin Function  
1
2
3
4
Pin Function  
P1.5/CEX2  
P1.6/SCL0  
P1.7/SDA0  
RST  
16  
17  
V
1
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
P0.7/AD7  
P0.6/AD6  
P0.5/AD5  
P0.4/AD4  
P0.3/AD3  
P0.2/AD2  
P0.1/AD1  
P0.0/AD0  
SS  
ALE/PROG  
1
NIC (8xC660)/  
SCL1 (8xC661)  
RxD  
3
TxD  
INT0  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
P2.0/A8  
P2.1/A9  
P2.2/A10  
P2.3/A11  
P2.4/A12  
P2.5/A13  
P2.6/A14  
P2.7/A15  
PSEN  
5
6
P3.0/RxD  
2
INT1  
CEX3/T0  
CEX4/T1  
V
3
SS  
ADDRESS BUS  
SU01736  
7
8
9
P3.1/TxD  
P3.2/INT0  
P3.3/INT1  
P3.4/T0/CEX3  
P3.5/T1/CEX4  
P3.6/WR  
WR  
RD  
V
CC  
1
10  
11  
12  
13  
14  
15  
NIC (8xC660)/  
3
SDA1 (8xC661)  
40  
41  
42  
43  
44  
P1.0/T2  
P1.1/T2EX  
P1.2/ECI  
P1.3/CEX0  
P1.4/CEX1  
P3.7/RD  
XTAL2  
XTAL1  
ALE  
2
V
2
SS  
EA/V  
PP  
PINNING  
Plastic Leaded Chip Carrier  
SU01738  
1. No internal connection  
2. May be left open, but it is recommended to connect V 2 and  
SS  
V
SS  
3 to GND to improve EMC performance  
6
1
40  
3. P8xC661X2 devices only  
7
39  
P8xC660X2/661X2  
17  
29  
18  
Pin Function  
28  
Pin Function  
Pin Function  
1
1
NIC (8xC660)/  
SDA1 (8xC661)  
16  
17  
18  
19  
20  
21  
22  
23  
P3.4/T0/CEX3  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
P2.6/A14  
P2.7/A15  
PSEN  
3
P3.5/T1/CEX4  
P3.6/WR  
P3.7/RD  
XTAL2  
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
P1.0/T2  
P1.1/T2EX  
P1.2/ECI  
P1.3/CEX0  
P1.4/CEX1  
P1.5/CEX2  
P1.6/SCL0  
P1.7/SDA0  
RST  
ALE  
2
V
2
SS  
XTAL1  
EA/V  
PP  
V
1
1
P0.7/AD7  
P0.6/AD6  
P0.5/AD5  
P0.4/AD4  
P0.3/AD3  
P0.2/AD2  
P0.1/AD1  
P0.0/AD0  
SS  
NIC (8xC660)/  
3
SCL1 (8xC661)  
24  
25  
26  
27  
28  
29  
P2.0/A8  
P2.1/A9  
P3.0/RxD  
2
P2.2/A10  
P2.3/A11  
P2.4/A12  
P2.5/A13  
V
3
SS  
P3.1/TxD  
P3.2/INT0  
P3.3/INT1  
V
CC  
SU01737  
1. No internal connection  
2. May be left open, but it is recommended to connect V 2 and  
SS  
V
SS  
3 to GND to improve EMC performance  
3. P8xC661X2 devices only, these pins are open-drain and have  
the same electrical characteristics as P1.6 and P1.7  
6
2003 Oct 02  

P87C660X2BBD 替代型号

型号 品牌 替代类型 描述 数据表
P87C660X2BBD,157 NXP

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