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P4SMAJ30AP PDF预览

P4SMAJ30AP

更新时间: 2024-11-15 08:04:27
品牌 Logo 应用领域
美微科 - MCC 电视
页数 文件大小 规格书
4页 106K
描述
DIODE 400 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AC, SMA, 2 PIN, Transient Suppressor

P4SMAJ30AP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DO-214AC
包装说明:SMA, 2 PIN针数:2
Reach Compliance Code:unknown风险等级:5.34

P4SMAJ30AP 数据手册

 浏览型号P4SMAJ30AP的Datasheet PDF文件第2页浏览型号P4SMAJ30AP的Datasheet PDF文件第3页浏览型号P4SMAJ30AP的Datasheet PDF文件第4页 
M C C  
P4SMAJ5.0  
THRU  
P4SMAJ440CA  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
400 Watt  
For Surface Mount Applications  
Unidirectional And Bidirectional  
Transient Voltage  
Suppressors  
Low Inductance  
High Temp Soldering: 250°C for 10 Seconds At Terminals  
For Bidirectional Devices Add “C” To The Suffix Of The Part  
5.0 to 440 Volts  
Number: i.e.SMAJ5.0C or P4SMAJ5.0CA for 5% Tolerance  
P4SMAJ5.0~P4SMAJ440CA also can be named as  
SMAJ5.0~SMAJ440CA and have the same electrical spec  
DO-214AC  
(SMA)(LEAD FRAME)  
UL Recognized File # E222849  
0HFKDQLFDOꢀ'DWD  
Case Material: Molded Plastic. UL Flammability  
Classification Rating 94V-0  
A
Polarity: Indicated by cathode band except bi-directional types  
B
0D[LPXPꢀ5DWLQJꢁꢀ  
Operating Temperature: -55°C to +150°C  
C
Storage Temperature: -55°C to +150°C  
Typical Thermal Resistance: 25 /W Junction to Ambient  
F
H
D
Peak Pulse Current on  
10/1000  
G
IPPM  
See Table 1 Note 1  
Min 400 W Note 1, 5  
E
DIMENSIONS  
Peak Pulse Power Dissipation  
PPPM  
INCHES  
MIN  
MM  
MIN  
DIM  
A
B
C
D
E
F
G
H
MAX  
.181  
.114  
.012  
.060  
.208  
.096  
.062  
.008  
MAX  
4.60  
2.90  
0.305  
1..52  
5.28  
2.44  
NOTE  
.157  
.098  
.006  
.030  
.188  
.078  
.055  
.002  
4.00  
2.50  
0.152  
0.76  
4.80  
2.00  
1.40  
Steady State Power Dissipation PM(AV)  
Peak Forward Surge Current IFSM  
1.0 W  
40A  
Note 2, 4  
Note:4  
1.60  
0.203  
0.051  
Notes: 1. Non-repetitive current pulse, per Fig.3 and derated above  
TA=25 per Fig.2.  
SUGGESTED SOLDER  
PAD LAYOUT  
2. Mounted on 5.0mm2 copper pads to each terminal.  
3. 8.3ms, single half sine wave duty cycle = 4 pulses per  
Minutes maximum.  
0.085 ”  
MAX  
4. Lead temperature at TL = 75  
.
0.058 ”  
MIN  
5. Peak pulse power waveform is 10/1000  
.
0.05  
MIN  
w w w.m c c s e m i.c o m  
1 of 4  
Revision: 2  
2006/09/21  

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