Datasheet > OSHR1608C1A

OSHR1608C1A

更新时间： 2022-04-11 06:28:21

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OSHR1608C1A 数据手册

1.6 x 0.8 x 0.4mm SMD

OSXX1608C1A

Ver.a.2

Cautions:

1. After open the package, the LED should be kept at 30°C, 30%RH or less. The LED should

be soldered within 24 hours (1 day) after opening the package.

2. Heat generation must be taken into design consideration when using the LED.

3. Power must be applied resistors for protection, over current would be caused the optic

damage to the devices and wavelength shift.

4. Manual tip solder may cause the damage to Chip devices, so advised that heat of iron

should be lower than 15W with temperature control under 5 seconds at 230-260 deg. C.

( The device would be got damage in re working process, recommended under 5 seconds

at 230-260 deg. C)

5. All equipment and machinery must be properly grounded. It is recommended to use a

wristband or anti-electrostatic glove when handing the LED.

6. Use IPA as a solvent for cleaning the LED. The other solvent may dissolve the LED

package and the epoxy, Ultrasonic cleaning should not be done.

7. Damaged LED will show unusual characteristics such as leak current remarkably increase,

turn-on voltage becomes lower and the LED get unlight at low current.

LED & Application Technologies

http://www.optosupply.com

VER A.0

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