OMAP3503ECUSA

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OMAP3503ECUSA 数据手册

OMAP3515/03 Applications Processor

www.ti.com

SPRS505–FEBRUARY 2008

1.2 Description

OMAP3515 and OMAP3503 high-performance, applications processors are based on the enhanced

OMAP™ 3 architecture.

The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing

sufficient to support the following:

•

Streaming video

2D/3D mobile gaming

Video conferencing

High-resolution still image

Video capture in 2.5G wireless terminals, 3G wireless terminals, and rich multimedia-featured

handsets, and high-performance personal digital assistants (PDAs).

The device supports high-level operating systems (OSs), such as:

•

Windows CE

Symbian OS

Linux

Palm OS

This OMAP device includes state-of-the-art power-management techniques required for high-performance

mobile products.

The following subsystems are part of the device:

•

Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor

SGX530 subsystem for 2D and 3D graphics acceleration to support display and gaming effects

(3515only)

•

Camera image signal processor (ISP) that supports multiple formats and interfacing options connected

to a wide variety of image sensors

Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a

programmable interface supporting a wide variety of displays. The display subsystem also supports

NTSC/PAL video out.

•

Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple

initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

•

A comprehensive power and clock-management scheme that enables high-performance, low-power

operation, and ultralow-power standby features. The device also supports SmartReflex™ adaptative

voltage control. This power management technique for automatic control of the operating voltage of a

module reduces the active power consumption.

•

Memory stacking feature using the package-on-package (POP) implementation (CBB package only)

OMAP3515/03 devices are available in a 515-pin PBGA package (CBB suffix) and a 423-pin PBGA

package (CUS suffix). Some features of the CBB package are not available in the CUS package.

Table 1-1 lists the differences between the CBB and CUS packages.

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OMAP3515/03 Applications Processor

1 234 5 6 7...227

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OMAP3503ECUSA 替代型号

型号	品牌	替代类型	描述	数据表
OMAP3503DCUSA	TI	完全替代	Applications Processor 423-FCBGA -40 to 105
OMAP3515ECUSA	TI	完全替代	暂无描述
OMAP3503ECUS	TI	类似代替	Sitara 处理器：Arm Cortex-A8、LPDDR \| CUS \| 423 \|

与OMAP3503ECUSA相关器件

型号	品牌	获取价格	描述	数据表
OMAP3515	TI	获取价格	Applications Processor
OMAP3515_08	TI	获取价格	Applications Processor
OMAP3515BCUS	TI	获取价格	IC,GRAPHICS PROCESSOR,CMOS,BGA,423PIN,PLASTIC
OMAP3515DCBC	TI	获取价格	OMAP3515/03 Applications Processor
OMAP3515DCBCA	TI	获取价格	Applications Processor 515-POP-FCBGA -40 to 105
OMAP3515DCUS	TI	获取价格	Applications Processor 423-FCBGA 0 to 90
OMAP3515DCUSA	TI	获取价格	Applications Processor 423-FCBGA -40 to 105
OMAP3515DCUSR	TI	获取价格	IC,GRAPHICS PROCESSOR,CMOS,BGA,423PIN,PLASTIC
OMAP3515ECBB	TI	获取价格	Sitara 处理器：Arm Cortex-A8、3D 图形、LPDDR \| CBB \|
OMAP3515ECBBA	TI	获取价格	Sitara Processor: Arm Cortex-A8, 3D Graphics, LPDDR 515-POP-FCBGA -40 to 105

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