是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-515 |
针数: | 515 | Reach Compliance Code: | compliant |
ECCN代码: | 3A001.A.3 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.76 | Is Samacsys: | N |
地址总线宽度: | 26 | 边界扫描: | YES |
最大时钟频率: | 59 MHz | 外部数据总线宽度: | 16 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B515 | JESD-609代码: | e1 |
长度: | 14 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 515 |
最高工作温度: | 90 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA515,26X26,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 1.1,1.8,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 1 mm | 速度: | 600 MHz |
子类别: | Graphics Processors | 最大供电电压: | 1.91 V |
最小供电电压: | 1.71 V | 标称供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 14 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
OMAP3525DZCBCA | TI |
获取价格 |
OMAP3525-HiRel Applications Processor 515-POP-FCBGA -40 to 105 | |
OMAP3525ECBB | TI |
获取价格 |
Applications Processor 515-POP-FCBGA 0 to 90 | |
OMAP3525ECBBA | TI |
获取价格 |
Applications Processor 515-POP-FCBGA -40 to 105 | |
OMAP3525ECBC | TI |
获取价格 |
Applications Processor 515-POP-FCBGA 0 to 0 | |
OMAP3525ECBCA | TI |
获取价格 |
暂无描述 | |
OMAP3525ECUS | TI |
获取价格 |
Applications Processor 423-FCBGA 0 to 90 | |
OMAP3525ECUSA | TI |
获取价格 |
应用处理器 | CUS | 423 | -40 to 105 | |
OMAP3525EZCBC | TI |
获取价格 |
OMAP3525-HiRel Applications Processor 515-POP-FCBGA -40 to 105 | |
OMAP3525-HIREL | TI |
获取价格 |
OMAP3525-HiRel and OMAP3530-HiRel Applications Processors | |
OMAP3530 | TI |
获取价格 |
Applications Processor |