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NX8561JC PDF预览

NX8561JC

更新时间: 2024-11-10 19:55:07
品牌 Logo 应用领域
瑞萨 - RENESAS 光纤
页数 文件大小 规格书
10页 178K
描述
FIBER OPTIC DFB LASER MODULE EMITTER, 1505-1515nm, THROUGH HOLE MOUNT, DIP, HERMETICALLY SEALED, DIP-14

NX8561JC 技术参数

生命周期:Obsolete包装说明:DIP
Reach Compliance Code:unknown风险等级:5.84
Is Samacsys:N主体宽度:21.84 mm
主体高度:12.16 mm主体长度或直径:25.4 mm
内置特性:TEC, THERMISTOR最长下降时间:0.5 ns
光纤设备类型:DFB LASER MODULE EMITTER光纤类型:9/125, SMF
安装特点:THROUGH HOLE MOUNT最大工作波长:1515 nm
最小工作波长:1505 nm标称工作波长:1510 nm
封装形式:DIP上升时间:0.5 ns
电源电流:80 mA表面贴装:NO
最小阈值电流:20 mA传输类型:DIGITAL
Base Number Matches:1

NX8561JC 数据手册

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To our customers,  
Old Company Name in Catalogs and Other Documents  
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology  
Corporation, and Renesas Electronics Corporation took over all the business of both  
companies. Therefore, although the old company name remains in this document, it is a valid  
Renesas Electronics document. We appreciate your understanding.  
Renesas Electronics website: http://www.renesas.com  
April 1st, 2010  
Renesas Electronics Corporation  
Issued by: Renesas Electronics Corporation (http://www.renesas.com)  
Send any inquiries to http://www.renesas.com/inquiry.  

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