MOSFET – Power, Single
N-Channel
40 V, 9.5 mW, 43 A
NVTYS010N04CL
Features
www.onsemi.com
• Small Footprint (3.3 x 3.3 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Capacitance to Minimize Driver Losses
• AEC−Q101 Qualified and PPAP Capable
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
• These Devices are Pb−Free and are RoHS Compliant
9.5 mW @ 10 V
40 V
43 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
15.5 mW @ 4.5 V
J
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
V
DSS
N−Channel
D (5 − 8)
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
D
43
A
C
q
JC
T
C
30
(Notes 1, 2, 3, 4)
Steady
State
Power Dissipation
T
C
P
D
32
W
A
G (4)
R
(Notes 1, 2, 3)
q
JC
T
C
= 100°C
16
Continuous Drain
Current R
T = 25°C
A
I
D
13
S (1, 2, 3)
q
JA
T = 100°C
A
9.4
3.0
1.5
162
(Notes 1, 3, 4)
Steady
State
Power Dissipation
T = 25°C
A
P
D
W
R
(Notes 1, 3)
q
JA
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ms
A
I
DM
A
p
LFPAK8
3.3x3.3
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
CASE 760AD
Source Current (Body Diode)
I
26
57
A
S
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (I
= 2.2 A)
MARKING DIAGRAM
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
010N
04CL
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
AWLYW
010N04CL = Specific Device Code
A
WL
Y
= Assembly Location
= Wafer Lot
= Year
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol
Value
4.8
Unit
WW
= Work Week
Junction−to−Case − Steady State (Note 3)
Junction−to−Ambient − Steady State (Note 3)
R
°C/W
q
JC
R
49.3
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which substantially
less than 100% of the heat flows to single case surface.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
2
3. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
4. Continuous DC current rating. Maximum current for pulses as long as 1
second is higher but is dependent on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
April, 2021 − Rev. 1
NVTYS010N04CL/D