NTS4409N
Small Signal MOSFET
25 V, 0.75 A, Single, N−Channel,
ESD Protection, SC−70/SOT−323
Features
http://onsemi.com
• Advance Planar Technology for Fast Switching, Low R
• Higher Efficiency Extending Battery Life
• This is a Pb−Free Device
DS(on)
V
R
DS(on)
Typ
I Max
D
(BR)DSS
249 mW @ 4.5 V
299 mW @ 2.7 V
25 V
0.75 A
Applications
• Boost and Buck Converter
• Load Switch
• Battery Protection
SC−70 (3−Leads)
Gate
1
2
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Drain−to−Source Voltage
Symbol Value Unit
3
Drain
V
25
"8.0
0.75
0.7
V
V
A
A
DSS
Gate−to−Source Voltage
Drain Current
V
GS
t < 5 s T = 25°C
I
A
D
D
Source
Continuous Drain Current
(Note 1)
T = 25°C
A
I
Steady
Top View
State
T = 75°C
A
0.6
Power Dissipation (Note 1)
Power Dissipation (Note 1)
Pulsed Drain Current
Steady State
P
P
0.28
0.33
3.0
W
W
A
D
D
MARKING DIAGRAM &
PIN ASSIGNMENT
t v 5 s
3
t = 10 ms
p
I
DM
3
Drain
Operating Junction and Storage Temperature
T ,
−55 to
+150
°C
J
1
T
STG
2
Source Current (Body Diode) (Note 1)
I
0.3
A
T4 WG
S
SC−70/SOT−323
CASE 419
G
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
260
°C
T
L
STYLE 8
1
Gate
2
ESD Rating − Machine Model
250
V
Source
THERMAL RESISTANCE RATINGS
Rating
T4
W
G
= Device Code
= Work Week
= Pb−Free Package
Symbol
Max
450
375
Unit
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient − t v 5 s (Note 1)
R
q
°C/W
JA
JA
(Note: Microdot may be in either location)
R
q
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
ORDERING INFORMATION
†
Device
Package
Shipping
NTS4409NT1G
SOT−323
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
January, 2006 − Rev. 2
NTS4409N/D