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NVD6828NLT4G-VF01 PDF预览

NVD6828NLT4G-VF01

更新时间: 2024-11-07 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 脉冲晶体管
页数 文件大小 规格书
6页 117K
描述
单 N 沟道功率 MOSFET 90V,41A,20mΩ

NVD6828NLT4G-VF01 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:DPAK-3/2Reach Compliance Code:not_compliant
Factory Lead Time:43 weeks 1 day风险等级:1.68
雪崩能效等级(Eas):90 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:90 V
最大漏极电流 (Abs) (ID):41 A最大漏极电流 (ID):41 A
最大漏源导通电阻:0.025 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):83 W最大脉冲漏极电流 (IDM):206 A
参考标准:AEC-Q101表面贴装:YES
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子位置:SINGLE晶体管元件材料:SILICON

NVD6828NLT4G-VF01 数据手册

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NVD6828NL  
Power MOSFET  
90 V, 20 mW, 41 A, Single NChannel  
Features  
Low R  
to Minimize Conduction Losses  
High Current Capability  
DS(on)  
Avalanche Energy Specified  
http://onsemi.com  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
I
D
(BR)DSS  
DS(on)  
20 mW @ 10 V  
25 mW @ 4.5 V  
90 V  
41 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
90  
Unit  
V
D
V
DSS  
GatetoSource Voltage  
V
"20  
41  
V
GS  
Continuous Drain Cur-  
T
= 25°C  
= 100°C  
= 25°C  
I
A
C
D
NChannel  
rent R  
(Notes 1 & 3)  
q
JC  
G
T
C
29  
Steady  
State  
Power Dissipation R  
(Note 1)  
T
C
P
83  
W
A
q
D
JC  
S
T
C
= 100°C  
42  
Continuous Drain  
T = 25°C  
A
I
8.7  
D
4
Current R  
2 & 3)  
(Notes 1,  
q
JA  
T = 100°C  
A
6.1  
Steady  
State  
2
1
Power Dissipation R  
(Notes 1 & 2)  
T = 25°C  
A
P
3.8  
1.9  
206  
W
q
D
JA  
3
T = 100°C  
A
DPAK  
CASE 369C  
STYLE 2  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
J
stg  
MARKING DIAGRAMS  
& PIN ASSIGNMENT  
Source Current (Body Diode)  
I
40  
90  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
4
Energy (T = 25°C, V = 10 V, I = 24.5 A,  
J
GS  
L(pk)  
Drain  
L = 0.3 mH, R = 25 W)  
G
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
2
Drain  
1
3
Gate Source  
THERMAL RESISTANCE MAXIMUM RATINGS  
Y
WW  
= Year  
= Work Week  
Parameter  
Symbol  
Value  
Unit  
JunctiontoCase Steady State (Drain)  
R
1.8  
40  
°C/W  
6828L = Device Code  
= PbFree Package  
q
JC  
G
JunctiontoAmbient Steady State (Note 2)  
R
q
JA  
1. The entire application environment impacts the thermal resistance values  
shown, they are not constants and are only valid for the particular conditions  
noted.  
ORDERING INFORMATION  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
Device  
Package  
Shipping  
3. Continuous DC current rating. Maximum current for pulses as long as 1  
second is higher but is dependent on pulse duration and duty cycle.  
NVD6828NLT4G  
DPAK  
2500/Tape & Reel  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
March, 2013 Rev. 1  
NVD6828NL/D  
 

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