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NUF2441FCT1 PDF预览

NUF2441FCT1

更新时间： 2024-02-26 22:05:09
品牌 Logo 应用领域
安森美 - ONSEMI 数据线路滤波器无源滤波器过滤器LTE
页数 文件大小 规格书
4页 51K
描述
Integrated Passive Filter with ESD Protection

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中文翻译

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NUF2441FCT1 技术参数

是否无铅：含铅生命周期：Contact Manufacturer
包装说明：CASE 499J-01, FLIP CHIP-6针数：6
Reach Compliance Code：not_compliantECCN代码：EAR99
HTS代码：8504.50.80.00风险等级：5.48
Is Samacsys：N电容：250 µF
最大直流电阻：0.35 Ω滤波器类型：DATA LINE FILTER
高度：0.7 mm电感：0.0029 µH
JESD-609代码：e0长度：1.72 mm
安装类型：SURFACE MOUNT功能数量：2
端子数量：6最高工作温度：125 °C
最低工作温度：-40 °C包装材料：PLASTIC
包装方法：TAPE AND REEL物理尺寸：L1.72XB1.22XH0.7 (mm)/L0.068XB0.048XH0.028 (inch)
额定电压：12 V子类别：Data Line Filters
端子面层：Tin/Lead (Sn/Pb)宽度：1.22 mm
Base Number Matches：1

NUF2441FCT1 数据手册

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NUF2441FC  
Integrated Passive Filter  
with ESD Protection  
This device is designed for cell phone applications requiring  
Headset and Speaker Phone, EMI Filtering and ESD Protection.  
This device offers an integrated solution in a small package reducing  
PCB space and cost.  
http://onsemi.com  
Features:  
CIRCUIT DESCRIPTION  
• Provides EMI Filtering and ESD Protection  
• Single IC Offers Cost Savings by Replacing 2 Inductors,  
B2  
4 Capacitors, and 4 TVs Diodes  
C
C
C
C
2
2
1
1
• Compliance with IEC61000−4−2, (Level 4)  
30 kV (Contact), 30 kV (air)  
L
L
B1  
A1  
B3  
A3  
• Flip−Chip Package  
• Moisture Sensitivity Level 1  
• ESD Ratings: Machine Model = C  
ESD Ratings: Human Body Model = 3B  
• This is a Pb−Free Device*  
A2  
MARKING  
DIAGRAM  
Benefits:  
• Flip−Chip Package Minimizes PCB Space  
• Integrated Circuit Increases System Reliability versus Discrete  
A1  
Component Implementation  
2441AYWW  
Flip−Chip  
CASE 499J  
• TVs Devices Provide ESD Protection That is Better than a Discrete  
Implementation because the Small IC minimizes Parasitic  
Inductances  
2441  
A
Y
= Specific Device Code  
= Assembly Location  
= Year  
Typical Applications:  
• Cell Phones  
• Communication Circuits  
WW  
= Work Week  
PIN CONFIGURATION  
MAXIMUM RATINGS (T = 25°C)  
A
A1  
A2  
A3  
B1  
Rating  
Symbol  
Value  
Unit  
ESD Discharge IEC61000−4−2  
Contact Discharge  
Air Discharge  
V
pp  
kV  
30  
30  
B2  
B3  
Operating Temperature Range  
Storage Temperature Range  
T
J
−40 to +125  
−55 to +150  
260  
°C  
°C  
°C  
T
stg  
(Bump View)  
Lead Solder Temperature  
(10 second duration)  
T
L
ORDERING INFORMATION  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
†
Package  
Device  
Shipping  
NUF2441FCT1  
Flip−Chip 3000/Tape & Reel  
NUF2441FCT1G  
Flip−Chip 3000/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
May, 2005 − Rev. 4  
NUF2441FC/D  
1234

中文翻译

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