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NTTS2P02R2 PDF预览

NTTS2P02R2

更新时间: 2024-11-21 03:34:35
品牌 Logo 应用领域
安森美 - ONSEMI 晶体小信号场效应晶体管开关光电二极管
页数 文件大小 规格书
8页 88K
描述
Power MOSFET -2.4 Amps, -20 Volts Single P-Channel Micro8

NTTS2P02R2 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete包装说明:MINIATURE, CASE 846A-02, MICRO-8
针数:8Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.18
Is Samacsys:N其他特性:LOGIC LEVEL COMPATIBLE
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):2.4 A最大漏极电流 (ID):2.4 A
最大漏源导通电阻:0.09 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-PDSO-G8JESD-609代码:e0
湿度敏感等级:1元件数量:1
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):1.4 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin/Lead (Sn80Pb20)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTTS2P02R2 数据手册

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NTTS2P02R2  
Power MOSFET  
-2.4 Amps, -20 Volts  
Single P–Channel Micro8t  
Features  
Ultra Low R  
DS(on)  
http://onsemi.com  
Higher Efficiency Extending Battery Life  
Logic Level Gate Drive  
Miniature Micro–8 Surface Mount Package  
Diode Exhibits High Speed, Soft Recovery  
Micro8 Mounting Information Provided  
–2.4 AMPERES  
–20 VOLTS  
R
= 90 mW  
DS(on)  
Applications  
Power Management in Portable and Battery–Powered Products, i.e.:  
Cellular and Cordless Telephones and PCMCIA Cards  
Single P–Channel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
Unit  
Drain–to–Source Voltage  
V
–20  
V
V
DSS  
Gate–to–Source Voltage – Continuous  
V
±8.0  
GS  
G
Thermal Resistance –  
Junction–to–Ambient (Note 1.)  
R
P
D
I
I
160  
0.78  
–2.4  
–1.92  
–20  
°C/W  
W
A
A
A
θJA  
S
Total Power Dissipation @ T = 25°C  
A
Continuous Drain Current @ T = 25°C  
A
D
D
Continuous Drain Current @ T = 70°C  
A
MARKING  
Pulsed Drain Current (Note 3.)  
I
DM  
DIAGRAM  
Thermal Resistance –  
Junction–to–Ambient (Note 2.)  
Total Power Dissipation @ T = 25°C  
Continuous Drain Current @ T = 25°C  
Continuous Drain Current @ T = 70°C  
Pulsed Drain Current (Note 3.)  
8
R
P
D
I
I
88  
1.42  
–3.25  
–2.6  
–30  
°C/W  
W
A
A
A
θJA  
A
1
A
A
D
D
YWW  
AD  
Micro8  
CASE 846A  
STYLE 1  
I
DM  
T , T  
Operating and Storage  
Temperature Range  
–55 to  
+150  
°C  
J
stg  
Single Pulse Drain–to–Source Avalanche  
E
AS  
350  
mJ  
Energy – Starting T = 25°C  
Y
= Year  
J
(V  
= –20 Vdc, V  
= –4.5 Vdc,  
WW  
AD  
= Work Week  
= Device Code  
DD  
GS  
Peak I = –5.0 Apk, L = 28 mH,  
L
R
= 25 )  
G
Maximum Lead Temperature for Soldering  
Purposes for 10 seconds  
T
L
260  
°C  
PIN ASSIGNMENT  
1. Minimum FR–4 or G–10 PCB, Steady State.  
2. Mounted onto a 2square FR–4 Board (1sq. 2 oz Cu 0.06thick single  
sided), Steady State.  
Source  
1
8
7
Drain  
Drain  
Drain  
Drain  
2
Source  
Source  
Gate  
3
4
6
5
3. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%.  
Top View  
ORDERING INFORMATION  
Device  
Package  
Shipping  
4000/Tape & Reel  
NTTS2P02R2  
Micro8  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
December, 2000 – Rev. 4  
NTTS2P02R2/D  

NTTS2P02R2 替代型号

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