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NTR1P02T1 PDF预览

NTR1P02T1

更新时间: 2024-11-24 22:24:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 50K
描述
Power MOSFET

NTR1P02T1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:SOT-23包装说明:MINIATURE, CASE 318-09, TO-236, 3 PIN
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.21.00.95
风险等级:5.09配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):1 A
最大漏极电流 (ID):1 A最大漏源导通电阻:0.18 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-236AB
JESD-30 代码:R-PDSO-G3JESD-609代码:e0
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):0.4 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTR1P02T1 数据手册

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NTR1P02T1  
Power MOSFET  
−20 V, −1 A, P−Channel SOT−23 Package  
Features  
Ultra Low On−Resistance Provides Higher Efficiency  
http://onsemi.com  
and Extends Battery Life  
R
DS(on)  
R
DS(on)  
= 0.180 W, V = −10 V  
GS  
= 0.280 W, V = −4.5 V  
GS  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
Power Management in Portable and Battery−Powered Products  
Miniature SOT−23 Surface Mount Package Saves Board Space  
Mounting Information for SOT−23 Package Provided  
−20 V  
148 mW @ −10 V  
−1.0 A  
P−Channel  
Applications  
D
DC−DC Converters  
Computers  
Printers  
PCMCIA Cards  
Cellular and Cordless Telephones  
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Drain−to−Source Voltage  
Gate−to−Source Voltage − Continuous  
Drain Current  
Symbol  
Value  
−20  
Unit  
V
MARKING DIAGRAM/  
PIN ASSIGNMENT  
V
DSS  
V
GS  
±20  
V
3
3
A
Drain  
− Continuous @ T = 25°C  
I
D
−1.0  
1
A
− Pulsed Drain Current (t 1 ms)  
I
−2.67  
p
DM  
2
P2W  
Total Power Dissipation @ T = 25°C  
P
400  
mW  
A
D
SOT−23  
CASE 318  
STYLE 21  
Operating and Storage Temperature Range  
T , T  
J
− 55 to  
150  
°C  
stg  
1
Gate  
2
Source  
Thermal Resistance − Junction−to−Ambient  
R
300  
260  
°C/W  
°C  
q
JA  
P2  
W
= Specific Device Code  
= Work Week  
Maximum Lead Temperature for Soldering  
Purposes, (1/8from case for 10 s)  
T
L
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
ORDERING INFORMATION  
Device  
Package  
SOT−23  
SOT−23  
Shipping  
NTR1P02T1  
NTR1P02T3  
3000/Tape & Reel  
10,000/Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
July, 2004 − Rev. 3  
NTR1P02T1/D  

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