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NSWC105K100TRH4F PDF预览

NSWC105K100TRH4F

更新时间： 2024-02-11 10:57:46
品牌 Logo 应用领域
尼吉康 - NICHICON 电容器
页数 文件大小 规格书
2页 96K
描述
CAPACITOR, METALLIZED FILM, POLYETHYLENE NAPHTHALATE, 100V, 1uF, SURFACE MOUNT, 3925, CHIP

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NSWC105K100TRH4F 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete包装说明：, 3925
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.25.00.45风险等级：5.72
电容：1 µF电容器类型：FILM CAPACITOR
介电材料：POLYETHYLENE NAPHTHALATEJESD-609代码：e1
安装特点：SURFACE MOUNT负容差：10%
端子数量：2最高工作温度：85 °C
最低工作温度：-55 °C封装形状：RECTANGULAR PACKAGE
包装方法：TR, EMBOSSED PLASTIC正容差：10%
额定（直流）电压（URdc）：100 V尺寸代码：3925
表面贴装：YES端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形状：WRAPAROUNDBase Number Matches：1

NSWC105K100TRH4F 数据手册

 浏览型号NSWC105K100TRH4F的Datasheet PDF文件第2页 
Stacked Film Capacitor Chips  
NSWC Series  
FEATURES  
• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM  
• STANDARD EIA 1913, 2416, 2820, 3022 AND 3925 SIZES  
• WIDE TEMPERATURE RANGE UP TO +105OC (16Vdc & 50Vdc)  
• HIGH HEAT AND MOISTURE RESISTANT  
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND  
nDIELECTRIC ABSORPTION CHARACTERISTICS  
• SUITABLE FOR REFLOWSOLDERING  
NEW  
• TAPE AND REEL PACKAGING  
Case Sizes  
SPECIFICATIONS  
1913  
2416  
2820  
3022  
3925  
Capacitance Range  
Voltage Ratings  
0.012µF ~ 0.22µF 0.1µF ~ 0.47µF 0.18µF ~ 0.33µF .39µF ~ .47µF .56µF ~ 1.0µF  
16Vdc, 50Vdc , 100Vdc  
NSWC IS  
RECOMMENDED  
FOR NEW DESIGNS  
Capacitance Tolerance  
Temperature Range  
Dissipation Factor (20°C)  
±10% (K) and ±5% (J)  
-55°C ~ +105°C (16Vdc and 50Vdc), -55°C ~ +85°C  
1.0% max @ 1 KHz  
3 Gigohms or 1000Ω/F whichever is lower  
Insulation Resistance (20°C)  
Dielectric Withstanding Voltage  
(16Vdc parts measured at 10Vdc)  
150% of Rated Voltage 60 Seconds  
175% of Rated Voltage for 5 Seconds (except 100Vdc parts)  
Temperature Characteristic  
Dielectric Absorption  
±3% ∆C Maximum Over Temperature Range  
0.05 ~ 0.10% Typical  
ENVIRONMENTAL CHARACTERISTICS  
Capacitance Change  
Within ±1% /-6% of Initial Value  
1.1% Maximum  
1 GigΩ Minimum or 300Ω/F whichever is lower  
Within ±3% of Initial Value  
1.1% Maximum  
1 GigΩ Minimum or 300Ω/F whichever is lower  
(1) +8%/-5%, (2 )±10%  
Life Test At +105°C  
1000 Hours at 125% of Rated Voltage  
(85°C for 100Vdc)  
Dissipation Factor  
Insulation Resistance  
Capacitance Change  
Dissipation Factor  
Insulation Resistance  
Capacitance Change  
Dissipation Factor  
Resistance to Soldering Heat:  
+240°C Peak for 5 Seconds  
(+230°C for 100Vdc)  
Humidity Load Life (90 ~ 95% RH)  
(1) 1000 Hours, +40°C  
(1) ±1.5%, (2 ) ±2%  
(500 Hours for 100Vdc)  
(2) 500 Hours, +60°C  
(1) 100 MegΩ or 30Ω/F (2) 10MegΩ or 3Ω/F  
Insulation Resistance  
whicher is lower  
Solderability with  
10% Wt Rosin-Methanol Flux  
90% Minimum Coverage After 5 Second Dip into 235°C Solder Pot  
RECOMMENDED SOLDERING PROFILES  
RECOMMENDED LAND PATTERN (mm)  
REFLOW SOLDERING  
300  
Soldering  
230°C Max.  
EIA Size  
A
B
C
(220°C for 100Vdc Parts)  
1913  
2416  
2820  
3022  
3925  
2.6  
3.8  
4.5  
5.1  
6.6  
7.8  
9.0  
9.7  
3.0  
3.8  
4.6  
5.0  
250  
T
E
M
Cool  
Down  
200  
Pre-Heat  
P
E
R
A
T
U
R
E
150°C Max.  
°C 150  
100  
7.2 11.9 5.7  
50  
0
5 Seconds Max.  
2 Minutes Min.  
A
B
2 1/2 Minutes Max.  
Less than  
15 Seconds  
®
175  
NIC COMPONENTS  
www.niccomp.com  
www.lowESR.com  
www.RFpassives.com  
12

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