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NSWC332J250TRD1NF

更新时间： 2024-11-04 19:58:31
品牌 Logo 应用领域
尼吉康 - NICHICON 高压电容器
页数 文件大小 规格书
2页 99K
描述
Film Capacitor, Polyethylene Naphthalate, 250V, 5% +Tol, 5% -Tol, 0.0033uF, Surface Mount, 1913, CHIP, ROHS COMPLIANT

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NSWC332J250TRD1NF 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：, 1913
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.25.00.45风险等级：5.57
电容：0.0033 µF电容器类型：FILM CAPACITOR
介电材料：POLYETHYLENE NAPHTHALATE高度：1.4 mm
长度：4.8 mm安装特点：SURFACE MOUNT
负容差：5%端子数量：2
最高工作温度：85 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE封装形式：SMT
包装方法：TR, EMBOSSED PLASTIC正容差：5%
额定（直流）电压（URdc）：250 V系列：NSWC(HIGH VOLTAGE)
尺寸代码：1913表面贴装：YES
端子形状：WRAPAROUND宽度：3.3 mm
Base Number Matches：1

NSWC332J250TRD1NF 数据手册

 浏览型号NSWC332J250TRD1NF的Datasheet PDF文件第2页 
NSWC Series  
(High Voltage)  
Stacked Film Capacitor Chips  
FEATURES  
NSWC IS  
RECOMMENDED  
FOR NEW DESIGNS  
• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM  
• STANDARD EIA 1913, 2416 and 2420 SIZES  
• HIGH HEAT AND MOISTURE RESISTANT  
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND  
nDIELECTRIC ABSORPTION CHARACTERISTICS  
• REFLOW SOLDERING ONLY  
RoHS  
Compliant  
includes all homogeneous materials  
*See Part Number System for Details  
• TAPE AND REEL PACKAGING  
Case Sizes  
SPECIFICATIONS  
1913  
0.001 ~ 0.015µF  
2416  
0.012 ~ 0.068µF  
250Vdc  
±5%(J)  
-55°C ~ +85°C  
1.0% max. @ 1KHz  
2420  
0.027 ~ 0.12µF  
Capacitance Range  
Voltage Ratings  
Capacitance Tolerance  
Temperature Range  
Dissipation Factor  
Insulation Resistance (20°C)  
Through 2K Ohm Resistor  
Dielectric Withstanding  
Voltage  
3 Gigohms @ 100Vdc  
150% of Rated Voltage  
Temperature Characteristic  
Dielectric Absorption  
±3% ∆C Maximum Over Temperature Range  
0.05 ~ 0.10% Typical  
ENVIRONMENTAL CHARACTERISTICS  
Capacitance Change  
Within ±1%/-6% of Initial Value  
1.1% Maximum  
1 GigΩ Minimum  
Within ±5% of Initial Value  
Life Test At +85°C  
1,000 Hours at 125% of Rated Voltage  
Dissipation Factor  
Insulation Resistance  
Capacitance Change  
Dissipation Factor  
Insulation Resistance  
Capacitance Change  
Dissipation Factor  
Insulation Resistance  
Capacitance Change  
Dissipation Factor  
Resistance to Soldering Heat:  
+240°C Peak  
1.1% Maximum  
1 GigΩ Minimum or 300Ω/F whichever is lower  
(1) +8%/-5%  
Humidity Load Life (90 ~ 95% RH)  
1,000 Hours, +40°C  
(1) ±1.5%  
(1) 100MegΩ  
Within ±5%  
Maximum 1.1%  
Resistance to Soldering Heat  
240°C for 5 seconds  
Insulation Resistance  
1GigΩ  
Solderability with  
25% Wt Rosin-Methanol Flux  
95% Minimum Coverage After 2.5 Second Dip into 245°C Solder Pot  
RECOMMENDED LAND  
PATTERN (mm)  
RECOMMENDED REFLOW PROFILE  
300  
EIA Size  
1913  
2416  
A
B
C
Standard: +240 °C Peak Temperature  
+250°C Special Order  
250  
200  
150  
2.6  
3.8  
3.8  
6.6  
7.8  
7.8  
3.0  
3.8  
4.6  
(see part numbering system)  
2420  
Cool Down  
100  
50  
Time above 220°C  
60 sec. max.  
Pre-heat  
150°C ~ 180°C  
120 sec. max.  
25  
Ramp-up  
25°C ~ 150°C  
90 sec. max.  
0
Time  
PART NUMBER SYSTEM  
NSWC 822 J 250 TR D1 N F  
RoHS Compliant  
Optional High Temp. Reflow (+250°C)*  
Size Code  
Tape & Reel  
Voltage  
Tolerance Code: J=±5%  
Capacitance in pF, 1st two digits are  
significant, 3rd digit is no. of zeros  
®
Series  
*Special packaging and handling required.  
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
51  
12

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