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NSPGF50AS PDF预览

NSPGF50AS

更新时间: 2024-10-28 04:13:03
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日亚株式会社 - NICHIA /
页数 文件大小 规格书
15页 258K
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GREEN LED

NSPGF50AS 数据手册

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Nichia STSE-CG7077A  
<Cat.No.070531>  
(4) Soldering Conditions  
· Nichia LED leadframes are silver plated copper alloy.  
This substance has a low  
thermal coefficient (easily conducts heat).  
Careful attention should be paid during soldering.  
· Solder the LED no closer than 3mm from the base of the epoxy bulb.  
of the tie bar is recommended.  
Soldering beyond the base  
· Recommended soldering conditions  
Dip Soldering  
120°C Max.  
60 seconds Max.  
260°C Max.  
Hand Soldering  
Pre-Heat  
Temperature  
Soldering Time  
Position  
350°C Max.  
3 seconds Max.  
No closer than 3 mm from the  
base of the epoxy bulb.  
Pre-Heat Time  
Solder Bath  
Temperature  
Dipping Time  
10 seconds Max.  
Dipping Position No lower than 3 mm from the  
base of the epoxy bulb.  
· Although the recommended soldering conditions are specified in the above table, dip or hand  
soldering at the lowest possible temperature is desirable for the LEDs.  
· A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.  
· Dip soldering should not be done more than one time.  
· Hand soldering should not be done more than one time.  
· Do not apply any stress to the lead particularly when heated.  
· The LEDs must not be repositioned after soldering.  
· After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until  
the LEDs return to room temperature.  
· Direct soldering onto a PC board should be avoided.  
from warping of the PC board or from the clinching and cutting of the leadframes.  
absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility  
for any problems. Direct soldering should only be done after testing has confirmed that no damage,  
such as wire bond failure or resin deterioration, will occur. Nichia’s LEDs should not be soldered  
Mechanical stress to the resin may be caused  
When it is  
directly to double sided PC boards because the heat will deteriorate the epoxy resin.  
· When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize  
the mechanical stress on the LEDs.  
· Cut the LED leadframes at room temperature.  
cause failure of the LEDs.  
Cutting the leadframes at high temperatures may  
(5) Heat Generation  
· Thermal design of the end product is of paramount importance.  
Please consider the heat generation  
of the LED when making the system design. The coefficient of temperature increase per input  
electric power is affected by the thermal resistance of the circuit board and density of LED  
placement on the board, as well as other components. It is necessary to avoid intense heat generation  
and operate within the maximum ratings given in this specification.  
· The operating current should be decided after considering the ambient maximum temperature of LEDs.  
(6) Cleaning  
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using  
other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not.  
Freon solvents should not be used to clean the LEDs because of worldwide regulations.  
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic  
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.  
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.  
-5-  

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