NSL21610/1
INDEX
Datasheet (EN) 1.0
1. PIN CONFIGURATION AND FUNCTIONS ..................................................................................................................................... 4
2. ABSOLUTE MAXIMUM RATINGS .................................................................................................................................................. 5
3. ESD RATINGS .............................................................................................................................................................................. 5
4. RECOMMENDED OPERATING CONDITIONS................................................................................................................................ 5
5. THERMAL INFORMATION ............................................................................................................................................................ 6
6. SPECIFICATIONS......................................................................................................................................................................... 6
6.1. ELECTRICAL CHARACTERISTICS...................................................................................................................................... 6
6.2. TYPICAL PERFORMANCE CHARACTERISTICS.................................................................................................................. 9
6.3. PARAMETER MEASUREMENT INFORMATION ................................................................................................................ 11
7. FUNCTION DESCRIPTION ......................................................................................................................................................... 11
7.1. OVERVIEW...................................................................................................................................................................... 11
7.2. SYSTEM DIAGRAM .......................................................................................................................................................... 11
7.3. FEATURE DESCRIPTION ................................................................................................................................................ 12
7.3.1.
POWER SUPPLY...................................................................................................................................................... 12
7.3.1.1. POWER ON RESET (POR).................................................................................................................................... 12
7.3.1.2. ON AND OFF ....................................................................................................................................................... 12
7.3.2.
7.3.3.
7.3.4.
OUTPUT CURRENT SETTING ................................................................................................................................. 12
OUTPUT CURRENT THERMAL BALANCING (NSL21610 ONLY) .............................................................................. 12
LED BRIGHTNESS DIMMING................................................................................................................................... 13
7.3.4.1. PWM CONTROL .................................................................................................................................................. 13
7.3.4.2. POWER SUPPLY CONTROL................................................................................................................................. 13
7.3.5.
PROTECTIONS AND DIAGNOSTICS ........................................................................................................................ 14
7.3.5.1. OPEN-LOAD DETECTION.................................................................................................................................... 14
7.3.5.2. SHORT-TO-GND DETECTION.............................................................................................................................. 14
7.3.5.3. THERMAL SHUTDOWN....................................................................................................................................... 14
7.3.5.4. FAULT BUS .......................................................................................................................................................... 14
7.4. DEVICE OPERATION MODE............................................................................................................................................ 15
7.4.1.
7.4.2.
7.4.3.
7.4.4.
NORMAL OPERATION............................................................................................................................................. 15
UNDERVOLTAGE LOCKOUT(UVLO) ........................................................................................................................ 15
LOW DROPOUT OPERATION.................................................................................................................................. 16
FAULT OPERATION ................................................................................................................................................. 16
8. APPLICATION ............................................................................................................................................................................ 16
8.1. TYPICAL APPLICATION CIRCUIT .................................................................................................................................... 16
8.1.1.
SIMPLE APPLICATION WITHOUT MCU................................................................................................................... 16
8.1.1.1. DESIGN INFORMATION....................................................................................................................................... 16
8.1.1.2. DESIGN PROCEDURE ......................................................................................................................................... 16
8.1.2.
APPLICATION WITH MCU ....................................................................................................................................... 17
8.1.2.1. DESIGN INFORMATION....................................................................................................................................... 18
8.1.2.2. DESIGN PROCEDURE ......................................................................................................................................... 18
9. LAYOUT ..................................................................................................................................................................................... 19
9.1. LAYOUT GUIDELINES..................................................................................................................................................... 19
9.2. LAYOUT EXAMPLE.......................................................................................................................................................... 19
9.3. RECOMMENDED FOOTPRINT ........................................................................................................................................ 21
Copyright © 2023, NOVOSENSE
Page 2
5秒后页面跳转
MAX7219驱动8段数码管详解及数据手册关键信息
ATMEGA328P技术资料深入分析
AT24C02芯片手册管脚信息、参数分析、应用领域详解
AT24C256芯片手册参数分析、引脚说明、读写程序示例
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
