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NS41024S55E-SMD PDF预览

NS41024S55E-SMD

更新时间: 2024-01-24 14:25:47
品牌 Logo 应用领域
美国国家半导体 - NSC 静态存储器内存集成电路
页数 文件大小 规格书
16页 42K
描述
IC,SRAM,128KX8,CMOS,LLCC,32PIN,CERAMIC

NS41024S55E-SMD 技术参数

生命周期:Obsolete包装说明:QCCN, LCC32,.45X.55
Reach Compliance Code:unknown风险等级:5.84
最长访问时间:55 nsI/O 类型:COMMON
JESD-30 代码:R-XQCC-N32内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:128KX8输出特性:3-STATE
封装主体材料:CERAMIC封装代码:QCCN
封装等效代码:LCC32,.45X.55封装形状:RECTANGULAR
封装形式:CHIP CARRIER并行/串行:PARALLEL
电源:5 V认证状态:Not Qualified
筛选级别:38535Q/M;38534H;883B最大待机电流:0.01 A
最小待机电流:4.5 V子类别:SRAMs
最大压摆率:0.125 mA标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:NO LEAD
端子节距:1.27 mm端子位置:QUAD
Base Number Matches:1

NS41024S55E-SMD 数据手册

 浏览型号NS41024S55E-SMD的Datasheet PDF文件第3页浏览型号NS41024S55E-SMD的Datasheet PDF文件第4页浏览型号NS41024S55E-SMD的Datasheet PDF文件第5页浏览型号NS41024S55E-SMD的Datasheet PDF文件第7页浏览型号NS41024S55E-SMD的Datasheet PDF文件第8页浏览型号NS41024S55E-SMD的Datasheet PDF文件第9页 
MICROCIRCUIT DATA SHEET  
MDNS41024S55-X REV 0B0  
Electrical Characteristics  
AC PARAMETERS: ELECTRICAL CHARACTERISTICS(Continued)  
(The following conditions apply to all the following parameters, unless otherwise specified.)  
AC: -55 C < Tc < +125 C, Vss = 0V, 4.5V < Vcc < 5.5V  
PIN-  
NAME  
SUB-  
SYMBOL  
tWLQZ  
PARAMETER  
CONDITIONS  
NOTES  
MIN  
MAX UNIT  
GROUPS  
Write Enable to  
Output Disable  
1,  
20  
nS  
9, 10,  
11  
3,  
4,  
5, 8  
tWHQX  
Output Active  
after end of  
Write  
1,  
5
nS  
9, 10,  
11  
3,  
4,  
5, 8  
Data Retention Electrical Characteristics: AC  
(The following conditions apply to all the following parameters, unless otherwise specified.)  
AC: -55 C < Tc < +125 C, Vss = 0V, 4.5V < Vcc < 5.5V  
tCDR  
tR  
Retention Time  
1,  
0
nS  
nS  
9, 10,  
11  
3,  
4, 8  
Operation  
Recovery Time  
1,  
55  
9, 10,  
11  
3,  
4, 8  
Note 1: This parameter is tested initially and after any design or process change which could  
affect this parameter, and therefore shall be guaranteed to the limits specified in  
table 1.  
Note 2: Functional tests shall include the test table and other test patterns used for fault  
detection as approved by the qualifying activity. Outputs are measured at Vol < 1.5V,  
Voh > 1.5V.  
Note 3: For timing waveforms see Figure 4 and for output load circuits, see figure 5.  
Note 4: AC measurements assume transition time < 5nS, input levels are from ground to 3.0V,  
and output load Cl > 30pF except as noted on figure 5. Timing reference Levels are  
1.5V.  
Note 5: Transition is measured +500 mV from steady state voltage.  
Note 6: Subgroup 4 (Cin and Cout measurements) shall be measured only for initial  
qualification and after any process or design changes which may affect input or  
output capacitance. Capacitance shall be measured between the designated terminal and  
Gnd at a frequency of 1 MHz. Sample size is 15 devices with no failures, and all  
input and output terminals tested.  
Note 7: For device class M subgroups 7 and 8 tests shall be sufficient to verify the truth  
table. For device classed B and S subgroups 7 and 8 tests shall be sufficient to  
verify the truth table as approved by the qualifying activity. For device classes Q  
and V subgroups 7 and 8 shall include verifying the functionality of the device;  
these tests shall have been fault graded in accordance with MIL-STD-883, test method  
5012.  
Note 8: See figure 4, as applicable.  
6

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