生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | LFBGA, | 针数: | 111 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.84 | 商用集成电路类型: | CONSUMER CIRCUIT |
JESD-30 代码: | S-PBGA-B111 | 长度: | 8 mm |
功能数量: | 1 | 端子数量: | 111 |
最高工作温度: | 75 °C | 最低工作温度: | -20 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
认证状态: | Not Qualified | 座面最大高度: | 1.3 mm |
最大供电电压 (Vsup): | 1.95 V | 最小供电电压 (Vsup): | 1.65 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL EXTENDED | 端子形式: | BALL |
端子节距: | 0.65 mm | 端子位置: | BOTTOM |
宽度: | 8 mm | Base Number Matches: | 1 |
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