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NMC-P1210NPO105K50TRPLPF PDF预览

NMC-P1210NPO105K50TRPLPF

更新时间: 2024-11-07 04:13:27
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NIC 电容器
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5页 84K
描述
Multilayer Ceramic Chip Capacitors

NMC-P1210NPO105K50TRPLPF 数据手册

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Multilayer Ceramic Chip Capacitors  
NMC-P Series  
FEATURES  
• CRACK RESISTANT TERMINATION  
• SOFT TERMINATION, OPEN MODE FAILURE  
• WIDE VOLTAGE RANGE (16V TO 5KV)  
• HIGH CAPACITANCE (UP TO 10µF)  
• RoHS COMPLIANT  
RoHS  
Compliant  
includes all homogeneous materials  
*See Part Number System for Details  
• SAC SOLDER COMPATIBLE**  
Temperature Coefficient  
Capacitance Range  
NPO  
2.2pF ~ 0.22µF  
X7R  
180pF ~ 10µF  
For 2.2pF ~ 10pF: ±0.1pF (B), ±0.25pF (C), ±0.5pF (D), ±1pF (F)  
Above 10pF: ±1% (F), ±2% (G), ±5% (J), ±10% (K)  
-55°C ~ +125°C  
Capacitance Tolerance  
±10% (K) & ±20% (M)  
Operating Temperature Range  
Temperature Characteristics  
Rated Voltages  
±30ppm/°C  
±15% Cap.  
16Vdc, 25Vdc, 50Vdc, 100Vdc, 200Vdc, 250Vdc, 500Vdc, 630Vdc, 1KVdc, 2Kvdc, 3Kvdc & 5Kvdc  
Q = > 1000 (more then 30pF)*  
2.5% max. @ 1KHz, 1.0V ± 0.2Vrms  
Q = > 400 + 20 x C in pF (30pF and below)*  
Q or Dissipation Factor  
insulation Resistance  
10,000Megohm or 500Megohm/µF whichever is less @ +25°C  
200% of rated voltage for 5 seconds, 50mA max. (16V ~ 250V)  
150% of rated voltage for 5 seconds, 50mA max. (500V ~ 630V)  
120% of rated voltage for 5 seconds, 50mA max. (1KV ~ 5KV)  
Dielectric Withstanding Voltage  
*Test Frequency & Voltage: Up to 100pF 1MHz/1.0Vrms, Above 100pF 1KHz/1.0Vrms  
**Reflow soldering is recommended. Contact NIC regarding the use of other soldering methods.  
PART NUMBER SYSTEM  
NMC-P 1206 X7R 105 K 50 TRP or TRPLP F  
RoHS Compliant  
Tape & Reel (Plastic Carrier)  
Tape & Reel (Paper Carrier)  
Voltage (Vdc)  
Capacitance Tolerance Code (see chart)  
Capacitance Code, expressed in pF, first 2 digits are  
significant, 3rd digit is no. of zeros  
Temperature Characteristic (NPO or X7R)  
Size Code (see chart)  
Series  
CONSTRUCTION  
Base layer (Cu 50V ~ 250V)  
(Ag 500V ~ up)  
Flexible layer (Polymer)  
Barrier layer (Ni)  
Finish layer (Sn)  
OPEN MODE FAILURE AS A RESULT OF BENDING STRESS  
Termination Separation  
(Open Failure Mode)  
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
NMC-P rev. 1 05302007  
15  

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