V-Chip Memory Back-Up Capacitors
NEXC Series
FEATURES
• DOUBLE LAYER CONSTRUCTION
*For high temperature +85°C,
high temperature reflow parts
• POWER BACK-UP FOR CMOS DEVICES
• SURFACE MOUNTABLE V-CHIP STYLE
• LEAD-FREE FINISH
see the NEXCW series
CHARACTERISTICS
3.5 & 5.5VDC
0.047F ~ 1.0F (47,000μF ~ 1,000,000μF)
Rated Voltage Range
Rated Capacitance Range
Operating Temp. Range
Capacitance Tolerance
-25°C ~ +70°C
+80%/-20% (Z)
Δ Capacitance Change
Maximum ESR
Less than ±30% of initial measured value
Load Life Test
+70°C 1,000 hours
Less than 200% of the specified maximum value
Less than 200% of the specified maximum value
Within +80%/-20% of specified value
Current at 30 minutes
Δ Capacitance Change
Maximum ESR
Temperature Cycling
(5 cycles, -25 ~ +70°C
Less than specified maximum value
Current at 30 minutes
Δ Capacitance Change
Maximum ESR
Less than specified maximum value
Less than ±20% of initial measured value
Less than 120% of the specified maximum value
Humidity Resistance
(240 hours @ 40°C/90% RH)
Current at 30 minutes
Less than 120% of the specified maximum value
STANDARD VALUES AND SPECIFICATIONS
Capacitance Working
Holding
Voltage
(VDC min.)
Max. Current Max. ESR
@ 30 minutes @ 1KHz
NIC P/N
Value (F)
Discharge
Voltage
(VDC)
(mA)
0.090
0.200
0.420
0.071
0.150
0.330
0.710
1.500
(Ω)
50
25
25
50
25
25
13
7
NEXC104Z3.5V10.5X5.5TRF
NEXC224Z3.5V10.5X5.5TRF
NEXC474Z3.5V10.5X8.5TRF
NEXC473Z5.5V10.5X5.5TRF
NEXC104Z5.5V10.5X5.5TRF
NEXC224Z5.5V10.5X8.5TRF
NEXC474Z5.5V16X9.5TRF
NEXC105Z5.5V21X10.5TRF
0.1
0.22
0.47
0.047
0.1
3.5
3.5
3.5
5.5
5.5
5,5
5.5
5.5
-
-
-
4.2
4.2
4.2
4.2
4.2
0.22
0.47
1.0
CASE DIMENSIONS (mm)
Case Size Dφ ± 0.5 L max. A/B ±0.2
I
W
P
10.5
10.5
16.0
21.0
10.5 x 5.5
10.5 x 8.5
16 x 9.5
5.5
8.5
9.5
10.5
10.8
10.8
16.3
21.6
3.6 ±0.5
3.6 ±0.5
6.8 ±1.0
7.0 ±1.0
1.2
1.2
1.2
1.4
5.0
5.0
5.0
10.0
21 x 10.5
I
+
-
I
I
w
Dφ
A
0.3mm max.
L
P
B
WASHING is NOT RECOMMENDED. Additional precautions can be found at
www.niccomp.com/precautions
If in doubt or uncertainty, please review your specific application - process details
with NIC’s technical support personnel: tpmg@niccomp.com
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
1
SPECIFICATIONS ARE SUBJECT TO CHANGE