Current Sensing Chip Resistors
NCSS Series
FEATURES
• SURFACE MOUNTABLE 0805, 1206, 2010 AND 2512 CASE SIZE
• LOW RESISTANCE METAL STRIP CONSTRUCTION
• PRECISON TOLERANCE (±1%)
• TAPED & REEL PACKAGING FOR EASY PICK AND PLACE
• REFLOW COMPATIBLE
RoHS
Compliant
includes all homogeneous materials
See Part Number System for Details
SPECIFICATIONS
Resistance
Tolerance
(Code)
Operating
Temperature
Range (°C)
EIA
Size
Power Rating
at 70°C
Temperature Coefficient
(ppm/°C, +25°C ~ +125°C)
Resistance
Range*
Type
1/8W (B)
1/4W (A)
1/2W (S)
1/4W (A)
1/2W (S)
1W (C)
NCSS10
0805
1206
±100ppm
5mΩ ~ 20mΩ
1mΩ ~ 30mΩ
1mΩ = ±200ppm
2mΩ ~ 10mΩ = ±100ppm
>10mΩ = ±75ppm
NCSS12
NCSS20
NCSS25
±1% (F)
±2% (G)
±5% (J)
1/2W (S)
3/4W (I)
1W (C)
-55°C ~ +170°C
5mΩ ~ 10mΩ = ±100ppm
>10mΩ = ±75ppm
2010
2512
5mΩ ~ 20mΩ
1.5W (D)
1W (C)
1mΩ ~ 50mΩ
1mΩ ~ 15mΩ
1mΩ ~ 10mΩ
1mΩ = ±275ppm
2mΩ ~ 10mΩ = ±100ppm
>10mΩ = ±75ppm
1.5W (D)
2W (E)
*Contact NIC regarding availability of values not shown
ENVIRONMENTAL CHARACTERISTICS
Specification
Item
Test Method
+25°C ~ +125°C
Reference Standard
0805
1206
2010
2512
Temperature Coefficient
of Resistance
IEC60115-1 4.8
JIS-C5201 4.8
Within specified value
1,000 hours at rated power, +70°C, 1.5 hours
ON, 0.5 hours OFF
IEC60115-1 4.25.1
JIS-C5201 4.25.1
IEC60115-1 4.13
JIS-C5201 4.13
IEC60115-1 4.24.2 1a
JIS-C5201 4.24.2 1a
IEC60115-1 4.19
JIS-C5201 4.19
Load Life
<±1%
<±1%
<±1%
<±1%
Short Time Overload
<±0.5% <±0.5% <±0.5% <±0.5%
<±1% <±1.0% <±1% <±1%
<±0.5% <±0.5% <±0.5% <±0.5%
5 x rated power for 5 seconds
+85°C, 85% RH, 1000 hours
Moisture Resistance
(no load)
-55°C & +155°C, 300 cycles,
15 minutes at each temperature
Temperature Cycling
+260°C ± 5°C for 10 sec. ±1 sec.,Two cycles
(20 sec. ±1 sec. for 2512 size)
IEC60115-1 4.18
JIS-C5201 4.18
Resistance to Soldering Heat <±0.5% <±0.5% <±0.5% <±0.5%
At least 95% coverage of electrode
IEC60115-1 4.17
JIS-C5201 4.17
Solderability
surface
+245°C ± 5°C, 2 sec. ± 0.5sec.
+170°C for 1,000 hours
-55°C for 1,000 hours
Bending within 2mm
IEC60115-1 4.23.2
JIS-C5201 4.23.2
IEC60115-1 4.23.4
JIS-C5201 4.23.4
IEC60115-1 4.33
JIS-C5201 4.33
High Temperature Exposure
Low Temperature Storage
Substrate Bending
<±1%
<±1%
<±1%
<±1%
<±0.5% <±0.5% <±0.5% <±0.5%
<±1%
<±0.5% <±0.5% <±0.5%
IEC60115-1 4.6
JIS-C5201 4.6
Insulation Resistance
>100MΩ
100VDC for 1 minute
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
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SPECIFICATIONS ARE SUBJECT TO CHANGE