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NCP3163 PDF预览

NCP3163

更新时间: 2024-09-16 04:37:55
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器开关
页数 文件大小 规格书
20页 260K
描述
3.4 A, Step−Up/Down/Inverting 50−300 kHz Switching Regulator

NCP3163 数据手册

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NCP3163  
3.4 A, Step−Up/Down/  
Inverting 50−300 kHz  
Switching Regulator  
The NCP3163 Series is a performance enhancement to the popular  
MC33163 and MC34163 monolithic DC−DC converters. These  
devices consist of an internal temperature compensated reference,  
comparator, controlled duty cycle oscillator with an active current  
limit circuit, driver and high current output switch. This controller was  
specifically designed to be incorporated in step−down, step−up, or  
voltage−inverting applications with a minimum number of external  
components. The NCP3163 comes in an exposed pad package which  
can greatly increase the power dissipation of the built in power switch.  
http://onsemi.com  
MARKING  
DIAGRAMS  
16  
16  
1
NCP3163xPW  
AWLYYWWG  
SOIC−16W  
EXPOSED PAD  
PW SUFFIX  
CASE 751AG  
Features  
Output Switch Current in Excess of 3.0 A  
1
1
3.4 A Peak Switch Current  
Frequency is Adjustable from 50 kHz to 300 kHz  
Operation from 2.5 V to 40 V Input  
Externally Adjustable Operating Frequency  
Precision 2% Reference for Accurate Output Voltage Control  
Driver with Bootstrap Capability for Increased Efficiency  
Cycle−by−Cycle Current Limiting  
18  
18  
NCP3163x  
AWLYYWW G  
G
18−LEAD DFN  
MN SUFFIX  
CASE 505  
1
Internal Thermal Shutdown Protection  
Low Voltage Indicator Output for Direct Microprocessor Interface  
Exposed Pad Power Package  
NCP3163x = Specific Device Code  
= Assembly Location  
A
Low Standby Current  
WL = Wafer Lot  
YY = Year  
WW = Work Week  
This is a Pb−Free Device  
G
G
= Pb−Free Package  
= Pb−Free Package  
Current  
Limit  
8
7
6
5
9
+
(Note: Microdot may be in either location)  
V
in  
10  
11  
12  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 18 of this data sheet.  
+
V
CC  
C
in  
Oscillator  
*For additional information on our Pb−Free strategy  
and soldering details, please download the  
ON Semiconductor Soldering and Mounting  
Techniques Reference Manual, SOLDERRM/D.  
R
S
Q
Thermal  
4
3
13  
14  
V
CC  
+
+
2
1
15  
16  
+
+
LVI  
V
CC  
V
+
out  
(Bottom View)  
Figure 1. Typical Buck Application Circuit  
C
O
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
May, 2006 − Rev. 1  
NCP3163/D  

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