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NCP3231MNTXG PDF预览

NCP3231MNTXG

更新时间: 2024-11-24 01:23:27
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
15页 157K
描述
High Current Synchronous Buck Converter

NCP3231MNTXG 数据手册

 浏览型号NCP3231MNTXG的Datasheet PDF文件第2页浏览型号NCP3231MNTXG的Datasheet PDF文件第3页浏览型号NCP3231MNTXG的Datasheet PDF文件第4页浏览型号NCP3231MNTXG的Datasheet PDF文件第5页浏览型号NCP3231MNTXG的Datasheet PDF文件第6页浏览型号NCP3231MNTXG的Datasheet PDF文件第7页 
NCP3231  
High Current Synchronous  
Buck Converter  
The NCP3231 is a high current, high efficiency, voltage−feed−  
forward voltage−mode synchronous buck converter which operates  
from 4.5 V to 18 V input and generates output voltages down to 0.6 V  
at up to 25 A DC load or 30 A instantaneous load.  
www.onsemi.com  
Features  
MARKING  
DIAGRAM  
Wide Input Voltage Range from 4.5 V to 18 V  
0.6 V Internal Reference Voltage  
500 kHz Switching Frequency  
External Programmable Soft−start  
Lossless Low−side FET Current Sensing  
Output Over−voltage Protection and Under−voltage Protection  
System Over−temperature Protection using a Thermistor or Sensor  
Hiccup Mode Operation for All Faults  
Pre−bias Start−up  
Adjustable Output Voltage  
Power Good Output  
Internal Over−temperature Protection  
This is a Pb−Free Device*  
1
1
40  
NCP3231  
AWLYYWWG  
QFN40 6x6, 0.5P  
CASE 485CM  
NCP3231 = Specific Device Code  
A
= Assembly Location  
= Wafer Lot  
WL  
YY  
WW  
G
= Year  
= Work Week  
= Pb−Free Package  
PIN CONNECTIONS  
Typical Applications  
Cellular Base Stations  
VIN  
VIN  
EN  
11  
40  
39  
38  
37  
ASIC, FPGA, DSP and CPU Core and I/O Supplies  
Telecom and Network Equipment  
Server and Storage System  
VCC  
VB  
12  
13  
14  
15  
16  
VIN  
EP42  
GND  
EP41  
VIN  
VIN  
PGND  
VSWH  
PGND  
36 BST  
35  
34  
33  
32  
31  
VSW  
PGND 17  
PGND 18  
VSWH  
VSWH  
VSWH  
VSWH  
VSWH  
EP43  
19  
20  
PGND  
PGND  
(TOP VIEW)  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NCP3231MNTXG  
QFN−40  
2500 /  
(Pb−Free)  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
May, 2015 − Rev. 5  
NCP3231/D  

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