是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | SOIC | 包装说明: | TSSOP, TSSOP10,.19,20 |
针数: | 10 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.33.00.01 |
Factory Lead Time: | 1 week | 风险等级: | 1.2 |
Samacsys Confidence: | 4 | Samacsys Status: | Released |
Samacsys PartID: | 1168970 | Samacsys Pin Count: | 10 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Small Outline Packages |
Samacsys Footprint Name: | Micro10 (Pb?Free) | Samacsys Released Date: | 2019-12-13 15:30:40 |
Is Samacsys: | N | 商用集成电路类型: | AUDIO AMPLIFIER |
JESD-30 代码: | S-PDSO-G10 | JESD-609代码: | e3 |
长度: | 3 mm | 湿度敏感等级: | 1 |
信道数量: | 2 | 功能数量: | 1 |
端子数量: | 10 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 标称输出功率: | 0.131 W |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP10,.19,20 | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2.5/5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.1 mm | 子类别: | Audio/Video Amplifiers |
最大压摆率: | 3.6 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2.2 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 3 mm | Base Number Matches: | 1 |
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