是否无铅: | 不含铅 | 生命周期: | Active |
包装说明: | XFBGA, BGA4,2X2,14 | Reach Compliance Code: | compliant |
Factory Lead Time: | 1 week | 风险等级: | 1.61 |
Samacsys Description: | NCP148 2V7 AD CSP SLEW RA | 可调性: | FIXED |
最大回动电压 1: | 0.3 V | 标称回动电压 1: | 0.18 V |
最大绝对输入电压: | 6 V | 最大输入电压: | 5.5 V |
最小输入电压: | 3.7 V | JESD-30 代码: | S-PBGA-B4 |
JESD-609代码: | e3 | 长度: | 0.64 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
输出次数: | 1 | 端子数量: | 4 |
工作温度TJ-Max: | 125 °C | 工作温度TJ-Min: | -40 °C |
最大输出电流 1: | 0.45 A | 最大输出电压 1: | 2.754 V |
最小输出电压 1: | 2.646 V | 标称输出电压 1: | 2.7 V |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | XFBGA |
封装等效代码: | BGA4,2X2,14 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH | 包装方法: | TR |
峰值回流温度(摄氏度): | NOT SPECIFIED | 调节器类型: | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR |
座面最大高度: | 0.33 mm | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin (Sn) |
端子形式: | BALL | 端子节距: | 0.35 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
最大电压容差: | 2% | 宽度: | 0.64 mm |
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