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NAND01G-N

更新时间: 2024-11-04 10:29:31
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存动态存储器
页数 文件大小 规格书
23页 214K
描述
1 Gbit (x8/x16) 2112 Byte Page NAND Flash Memory and 512 Mbit (x16) LPSDRAM, 1.8V, Multi-Chip Package

NAND01G-N 数据手册

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NAND01G-N  
1 Gbit (x8/x16) 2112 Byte Page NAND Flash Memory and  
512 Mbit (x16) LPSDRAM, 1.8V, Multi-Chip Package  
PRELIMINARY DATA  
Features summary  
Multi-chip Package  
– NAND Flash Memory  
FBGA  
– 512 Mbit or 1 Gbit (x8/x16) Large Page  
Size NAND Flash Memory  
– 512 Mbit (x16) SDR or DDR LPSDRAM  
Temperature range  
TFBGA107 10.5 x 13 x 1.2mm  
TFBGA149 10 x 13.5 x 1.2mm  
– -30 up to 85 °C  
Supply voltage  
– NAND Flash : VDDF = 1.7V to 1.95V  
– LPSDRAM: VDDD = VDDQD = 1.7V to 1.9V  
Electronic Signature  
ECOPACK packages  
SDR/DDR LPSDRAM  
Interface: x16 bus width  
Flash Memory  
Programmable Partial Array Self Refresh  
Auto Temperature Compensated Self Refresh  
Deep Power Down mode  
Nand Interface  
– x8 or x16 bus width  
– Multiplexed address/data  
1.8V LVCMOS interface  
Page size  
– x8 device: (2048 + 64 spare) Bytes  
– x16 device: (1024 + 32 spare) Words  
Quad internal Banks controlled by BA0 and  
BA1  
Wrap sequence: Sequential/Interleaved  
Automatic and Controlled Precharge  
Auto Refresh and Self Refresh  
8,192 Refresh Cycles/64ms  
Block size  
– x8 device: (128K + 4K spare) Bytes  
– x16 device: (64K + 2K spare) Words  
Page Read/Program  
– Random access: 25µs (max)  
– Sequential access: 50ns (min)  
– Page program time: 300µs (typ)  
Burst Termination by Burst Stop command and  
Precharge Command  
Copy Back Program mode  
– Fast page copy without external buffering  
Fast Block Erase  
– Block Erase time: 2ms (typ)  
Chip Enable ‘don’t care’  
– for simple interfacing with microcontrollers  
Status Register  
January 2006  
Rev1.0  
1/23  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to  
change without notice.  
www.st.com  
2

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