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MZA3216D241C PDF预览

MZA3216D241C

更新时间: 2024-11-07 12:02:07
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 73K
描述
Chip Beads(SMD Array) For General Signal Line MZA Series MZA3216 Type

MZA3216D241C 数据手册

 浏览型号MZA3216D241C的Datasheet PDF文件第2页浏览型号MZA3216D241C的Datasheet PDF文件第3页 
(1/3)  
Conformity to RoHS Directive  
Chip Beads(SMD Array)  
For General Signal Line  
MZA Series MZA3216 Type  
FEATURES  
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD  
PATTERN (REFLOW SOLDERING)  
• A single MZA series chip provides noise attenuation for four  
lines, making it ideal for use with I/O lines of various highly  
miniaturized.  
3.2 0.2  
Ferrite  
• Electronic equipment, such as portable products, which  
comprise high density circuitry.  
Terminal  
electrode  
• Low crosstalk between adjacent circuits.  
• Internal electrodes feature low DC resistance, minimizing  
wasteful power consumption.  
0.8 0.1  
0.4 0.15  
0.8  
0.4  
• Electroplated terminal electrodes accommodate reflow  
soldering.  
Weight: 20mg  
Dimensions in mm  
• Monolithic structure ensures high reliability.  
• The products contain no lead and also support lead-free  
soldering.  
TEMPERATURE RANGES  
Operating/storage –55 to +125°C  
• It is a product conforming to RoHS directive.  
PACKAGING STYLE AND QUANTITIES  
APPLICATIONS  
High-frequency noise countermeasure in computers, printers,  
VCRs, televisions, portable telephones, and other equipment.  
Packaging style  
Taping  
Quantity  
4000 pieces/reel  
HANDLING AND PRECAUTIONS  
PRODUCT IDENTIFICATION  
• Before soldering, be sure to preheat components. The preheat-  
ing temperature should be set so that the temperature difference  
between the solder temperature and product temperature does  
not exceed 150°C.  
MZA 3216 R 121 A  
T
(1) (2) (3) (4) (5) (6)  
(1) Series name  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• Do not expose the inductors to stray magnetic fields.  
• Avoid static electricity discharge during handling.  
• When hand soldering, apply the soldering iron to the printed cir-  
cuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
• This product does not apply to flow soldering construction  
method.  
(2) Dimensions L× W  
(3) Material code  
(4) Nominal impedance  
121:120at 100MHz  
(5) Characteristic type  
(6) Packaging style  
T:Taping  
RECOMMENDED SOLDERING CONDITION  
REFLOW SOLDERING  
10s max.  
250 to 260˚C  
230˚C  
Natural  
cooling  
180˚C  
150˚C  
Preheating  
60 to 120s  
Soldering  
30 to 60s  
Time(s)  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application are considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
007-01 / 20071025 / e9421_mza.

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