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MXSMBG58CAE3/TR PDF预览

MXSMBG58CAE3/TR

更新时间: 2024-11-13 18:22:59
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网光电二极管
页数 文件大小 规格书
4页 161K
描述
Trans Voltage Suppressor Diode, 600W, 58V V(RWM), Bidirectional, 1 Element, Silicon, DO-215AA, ROHS COMPLIANT, PLASTIC PACKAGE-2

MXSMBG58CAE3/TR 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:R-PDSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.62最大击穿电压:71.2 V
最小击穿电压:64.4 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码:DO-215AAJESD-30 代码:R-PDSO-G2
JESD-609代码:e3最大非重复峰值反向功率耗散:600 W
元件数量:1端子数量:2
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:BIDIRECTIONAL最大功率耗散:1.38 W
认证状态:Not Qualified最大重复峰值反向电压:58 V
表面贴装:YES技术:AVALANCHE
端子面层:MATTE TIN端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:40
Base Number Matches:1

MXSMBG58CAE3/TR 数据手册

 浏览型号MXSMBG58CAE3/TR的Datasheet PDF文件第2页浏览型号MXSMBG58CAE3/TR的Datasheet PDF文件第3页浏览型号MXSMBG58CAE3/TR的Datasheet PDF文件第4页 
TECHNICAL DATA SHEET  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
6 Lake Street, Lawrence, MA 01841  
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
Website: http://www.microsemi.com  
- High Reliability controlled devices  
SURFACE MOUNT 600 W  
Transient Voltage Suppressor  
- Unidirectional (A) and Bidirectional (CA) construction  
- Available in both J-bend and Gull-wing terminations  
- Selections for 5.0 to 170 V standoff voltages (VWM  
)
LEVELS  
M, MA, MX, MXL  
DEVICES  
MSMBJ5.0A thru MSMBJ170CA, e3  
and MSMBG5.0A thru MSMBG170CA, e3  
FEATURES  
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High reliability controlled devices with wafer fabrication and assembly lot traceability  
100 % surge tested devices  
Optional up screening available by replacing the M prefix with MA, MX or MXL. These  
prefixes specify various screening and conformance inspection options based on  
MIL-PRF-19500. Refer to MicroNote 129 for more details on the screening options.  
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Axial-leaded equivalent packages for through-hole mounting available as MP6KE6.8A to  
MP6KE200CA  
Refer to table below  
for dimensions  
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Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B  
RoHS compliant devices available by adding an “e3” suffix  
3σ lot norm screening performed on Standby Current ID  
APPLICATIONS / BENEFITS  
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Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, etc.  
Protection from switching transients & induced RF  
Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4  
Secondary lightning protection per IEC61000-4-5 with 42 Ohms source impedance:  
o
o
o
o
Class 1: MSMB5.0A to MSMB120CA  
Class 2: MSMB5.0A to MSMB60CA  
Class 3: MSMB5.0A to MSMB30CA  
Class 4: MSMB5.0A to MSMB15CA  
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Secondary lightning protection per IEC61000-4-5 with 12 Ohms source impedance:  
o
o
Class 1: MSMB5.0A to MSMB36CA  
Class 2: MSMB5.0A to MSMB18CA  
MAXIMUM RATINGS  
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Peak Pulse Power dissipation at 25 ºC: 600 watts at 10/1000 μs (also see Figures 1, 2, and  
3) with impulse repetition rate (duty factor) of 0.01 % or less  
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tclamping (0 volts to VBR min.): < 100 ps theoretical for unidirectional and < 5 ns for bidirectional  
Operating and Storage temperature: -65 °C to +150 °C  
Thermal resistance: 25 °C/W junction to lead, or 90 °C/W junction to ambient when mounted  
on FR4 PC board (1oz Cu) with recommended footprint (see page 2)  
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Steady-State Power dissipation: 5 watts at TL = 25 ºC, or 1.38 watts at TA = 25 ºC when  
mounted on FR4 PC board with recommended footprint (see page 2)  
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Forward Surge at 25 ºC: 100 Amp peak impulse of 8.3 ms half-sine wave (unidirectional only)  
Solder temperatures: 260 ºC for 10 s (maximum)  
RF01000 Rev B, Sept 2011  
High Reliability Product Group  
Page 1 of 4  

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