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MU1005121YL PDF预览

MU1005121YL

更新时间: 2024-11-24 05:51:11
品牌 Logo 应用领域
ABC /
页数 文件大小 规格书
6页 117K
描述
MULTILAYER CHIP BEAD

MU1005121YL 数据手册

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SPECIFICATION FOR APPROVAL  
REF :  
PROD.  
NAME  
PAGE: 1  
ABC'S DWG NO.  
ABC'S ITEM NO.  
MU1005□□□□L-□□□  
MULTILAYER CHIP BEAD  
Ⅰ﹒CONFIGURATION & DIMENSIONS:  
A
D
D
G
I
I
B
PCB Pattern  
Unit : m/m  
Series  
A
B
C
D
G
H
I
MU1005  
1.00±0.10  
0.50±0.10  
0.50±0.10  
0.20±0.10  
0.4  
0.4  
0.5  
Ⅱ﹒SCHEMATIC DIAGRAM:  
Ⅲ﹒MATERIALS:  
a
b
c
aBodyFerrite  
bInternal conductorSilver or Ag / Pd  
cTerminal electrodeAg/Ni/Sn  
dRemarkProducts comply with RoHS' requirements  
Ⅳ﹒GENERAL SPECIFICATION:  
aStorage temp.-40 ---- +105℃  
bOperating temp.-55 ---- +125℃  
Peak Temp260max.  
Max time above 230℃ :50sec max.  
Max time above 200℃ :70sec max.  
Temperature  
cTerminal strength:  
Rising Area  
Preheat Area  
Reflow Area  
Forced Cooling Area  
+2.0 ~ 4.0  
/ sec max.  
F
+4.0/ sec max.  
150 ~ 200/ 60 ~ 120sec  
-(1.0 ~ 5.0)/ sec max.  
Peak Temperature:  
260  
250  
200  
150  
100  
50  
Type  
F ( kgf )  
0.3  
Time ( sec )  
230℃  
50sec max.  
MU1005  
30±5  
70sec max.  
dSolderability:  
Solder : Sn96.5 / Ag3 / Cu0.5  
or equivalent  
Solder temp. : 260±5℃  
Flux : Rosin  
0
50  
100  
150  
Time ( seconds )  
200  
250  
Dip time : 4±1 seconds  
AR-001A  

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