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MTW45N10 PDF预览

MTW45N10

更新时间: 2024-01-11 13:44:26
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA /
页数 文件大小 规格书
8页 158K
描述
TMOS POWER FET 45 AMPERES 100 VOLTS RDS(on) = 0.035 OHM

MTW45N10 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:,Reach Compliance Code:unknown
风险等级:5.8配置:Single
最大漏极电流 (Abs) (ID):45 AFET 技术:METAL-OXIDE SEMICONDUCTOR
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):180 W
子类别:FET General Purpose Power表面贴装:NO
Base Number Matches:1

MTW45N10 数据手册

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Order this document  
by MTW45N10E/D  
SEMICONDUCTOR TECHNICAL DATA  
Motorola Preferred Device  
TMOS POWER FET  
45 AMPERES  
100 VOLTS  
N–Channel Enhancement–Mode Silicon Gate  
This advanced TMOS E–FET is designed to withstand high  
energy in the avalanche and commutation modes. The new energy  
efficient design also offers a drain–to–source diode with a fast  
recovery time. Designed for low voltage, high speed switching  
applications in power supplies, converters and PWM motor  
controls, these devices are particularly well suited for bridge circuits  
where diode speed and commutating safe operating areas are  
critical and offer additional safety margin against unexpected  
voltage transients.  
R
= 0.035 OHM  
DS(on)  
D
Avalanche Energy Specified  
Source–to–Drain Diode Recovery Time Comparable to a  
Discrete Fast Recovery Diode  
Diode is Characterized for Use in Bridge Circuits  
G
CASE 340K–01, Style 1  
TO–247AE  
I
and V  
Specified at Elevated Temperature  
DSS  
Isolated Mounting Hole Reduces Mounting Hardware  
DS(on)  
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Symbol  
Value  
Unit  
Drain–Source Voltage  
V
100  
Vdc  
Vdc  
DSS  
Drain–Gate Voltage (R  
= 1.0 M)  
V
DGR  
100  
GS  
Gate–Source Voltage — Continuous  
Gate–Source Voltage — Non–Repetitive (t 10 ms)  
V
± 20  
± 40  
Vdc  
Vpk  
GS  
V
GSM  
p
Drain Current — Continuous  
Drain Current — Continuous @ 100°C  
Drain Current — Single Pulse (t 10 µs)  
I
I
45  
34.6  
135  
Adc  
Apk  
D
D
I
p
DM  
Total Power Dissipation  
Derate above 25°C  
P
D
180  
1.44  
Watts  
W/°C  
Operating and Storage Temperature Range  
T , T  
stg  
55 to 150  
810  
°C  
J
Single Pulse Drain–to–Source Avalanche Energy — Starting T = 25°C  
E
AS  
mJ  
J
(V  
DD  
= 25 Vdc, V  
= 10 Vdc, I = 45 Apk, L = 0.8 mH, R = 25 )  
GS L G  
Thermal Resistance — Junction to Case  
Thermal Resistance — Junction to Ambient  
R
R
0.70  
62.5  
°C/W  
°C  
θJC  
θJA  
Maximum Lead Temperature for Soldering Purposes, 1/8from case for 10 seconds  
T
260  
L
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit  
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.  
E–FET and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.  
Preferred devices are Motorola recommended choices for future use and best overall value.  
REV 2  
Motorola, Inc. 1996  

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