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MTP8N50ET PDF预览

MTP8N50ET

更新时间： 2024-10-02 13:11:55
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
6页 162K
描述
8A, 500V, 0.8ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB

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中文翻译

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MTP8N50ET 技术参数

生命周期：Obsolete包装说明：FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code：unknown风险等级：5.76
Is Samacsys：N外壳连接：DRAIN
配置：SINGLE最小漏源击穿电压：500 V
最大漏极电流 (ID)：8 A最大漏源导通电阻：0.8 Ω
FET 技术：METAL-OXIDE SEMICONDUCTORJEDEC-95代码：TO-220AB
JESD-30 代码：R-PSFM-T3元件数量：1
端子数量：3工作模式：ENHANCEMENT MODE
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：FLANGE MOUNT极性/信道类型：N-CHANNEL
功耗环境最大值：125 W认证状态：Not Qualified
表面贴装：NO端子形式：THROUGH-HOLE
端子位置：SINGLE晶体管元件材料：SILICON
Base Number Matches：1

MTP8N50ET 数据手册

 浏览型号MTP8N50ET的Datasheet PDF文件第2页浏览型号MTP8N50ET的Datasheet PDF文件第3页浏览型号MTP8N50ET的Datasheet PDF文件第4页浏览型号MTP8N50ET的Datasheet PDF文件第5页浏览型号MTP8N50ET的Datasheet PDF文件第6页 
Order this document  
by MTP8N50E/D  
SEMICONDUCTOR TECHNICAL DATA  
N–Channel Enhancement–Mode Silicon Gate  
TMOS POWER FET  
This high voltage MOSFET uses an advanced termination  
scheme to provide enhanced voltage–blocking capability without  
degrading performance over time. In addition, this advanced TMOS  
E–FET is designed to withstand high energy in the avalanche and  
commutation modes. This new energy efficient design also offers a  
drain–to–source diode with a fast recovery time. Designed for low  
voltage, high speed switching applications in power supplies,  
converters, PWM motor controls, these devices are particularly well  
suited for bridge circuits where diode speed and commutating safe  
operating areas are critical and offer additional safety margin  
against unexpected voltage transients.  
8.0 AMPERES  
500 VOLTS  
R
= 0.8 OHM  
DS(on)  
D
•
•
•
Robust High Voltage Termination  
Avalanche Energy Specified  
Source–to–Drain Diode Recovery Time Comparable  
to a Discrete Fast Recovery Diode  
G
•
•
Diode is Characterized for Use in Bridge Circuits  
S
I
and V  
Specified at Elevated Temperature  
DSS  
DS(on)  
CASE 221A–06, Style 5  
TO-220AB  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
500  
Unit  
Vdc  
Vdc  
Drain–to–Source Voltage  
V
DSS  
Drain–to–Gate Voltage (R  
GS  
= 1.0 M  
)
V
DGR  
500  
Gate–to–Source Voltage – Continuous  
Gate–to–Source Voltage – Non–repetitive (tp ≤ 10 ms)  
V
±20  
±40  
Vdc  
Vpk  
GS  
V
GSM  
Drain Current — Continuous @ T = 25°C  
I
I
8.0  
5.0  
32  
Adc  
Apk  
C
D
D
Drain Current — Continuous @ T = 100°C  
C
I
Drain Current — Single Pulse (tp ≤ 10 s)  
DM  
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
125  
1.0  
Watts  
W/°C  
C
Operating and Storage Temperature Range  
T , T  
stg  
–55 to 150  
510  
°C  
J
Single Pulse Drain–to–Source Avalanche Energy – STARTING T = 25°C  
E
AS  
mJ  
J
(V  
DD  
= 25 Vdc, V  
= 10 Vdc, PEAK I = 8.0 Apk, L = 16 mH, R = 25  
)
GS  
L
G
Thermal Resistance  
– Junction–to–Case  
– Junction–to–Ambient  
R
R
1.0  
62.5  
JC  
JA  
°C/W  
°C  
Maximum Lead Temperature for Soldering Purposes, 1/8″ from Case for 5 sec.  
T
L
260  
This document contains information on a new product. Specifications and information herein are subject to change without notice.  
E–FET and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.  
REV 2  
Motorola, Inc. 1996  
123456

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