4Mb: 256K x 18, 128K x 32/36
FLOW-THROUGH SYNCBURST SRAM
REVISIONHISTORY
Updated package drawings ................................................................................................................................... January 9/03
Removed "Preliminary Package Data" from front page .............................................................................. February 22/02
Removed 119-pin PBGA package and references ........................................................................................ February 14/02
Removed note "Not Recommended for New Designs," Rev. 6/01 ...................................................................... June 7/01
Added Industrial Temperature note and references, Rev. 3/01, FINAL ......................................................... March 6/01
Added 119-pin PBGA package, Rev. 1/01, FINAL ........................................................................................... January 10/01
Removed FBGA Part Marking Guide, REV 8/00-A, FINAL .............................................................................. August 22/00
Changed FBGA capacitance values, REV 8/00, FINAL ....................................................................................... August 7/00
CI; TYP 2.5pF from 4pF; MAX. 3.5pF from 5pF
CO; TYP 4pF from 6pF; MAX. 5pF from 7pF
CCK; TYP 2.5pF from 5pF; MAX. 3.5pF from 6pF
Added FBGA Part Marking Guide, Rev. 7/00, Preliminary ................................................................................... July 17/00
Added revision history
Removed industrial temperature references
Added 165-pin FBGA package, Rev. 6/00, Preliminary ........................................................................................ May 23/00
4Mb: 256K x 18, 128K x 32/36 Flow-Through SyncBurst SRAM
MT58L256L18F1_F.p65 – Rev. F, Pub. 1/03 EN
MicronTechnology,Inc.,reservestherighttochangeproductsorspecificationswithoutnotice.
©2003,MicronTechnology,Inc.
26