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MT58L128L18PF-7.5IT PDF预览

MT58L128L18PF-7.5IT

更新时间: 2024-02-28 19:15:58
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器内存集成电路
页数 文件大小 规格书
25页 460K
描述
Standard SRAM, 128KX18, 4ns, CMOS, PBGA165, FBGA-165

MT58L128L18PF-7.5IT 数据手册

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2Mb : 128K x 18, 64K x 32/36  
PIPELINED, SCD SYNCBURST SRAM  
TQFP PIN DESCRIPTIONS (co n t in u e d )  
x18  
x32/x36  
SYMBOL TYPE  
DESCRIPTION  
85  
85  
ADSC#  
Input SynchronousAddressStatusController:ThisactiveLOWinput  
interrupts any ongoing burst, causing a new external address to be  
registered. A READ or WRITE is performed using the new address if  
CE# is LOW. ADSC# is also used to place the chip into power-down  
state when CE# is HIGH.  
31  
64  
31  
64  
MODE  
ZZ  
Input Mode: This input selects the burst sequence. A LOW on this pin  
selects linear burst.NC or HIGH on this pin selects interleaved  
burst.Do not alter input state while device is operating.  
Input Snooze Enable: This active HIGH, asynchronous input causes the  
device to enter a low-power standby mode in which all data in the  
memory array is retained. When ZZ is active, all other inputs are  
ignored.  
(a) 58, 59,  
62, 63, 68, 69, 56-59, 62, 63  
72, 73  
(a) 52, 53,  
DQa  
DQb  
Input/ SRAM Data I/Os: For the x18 version, Byte ais associated with  
Output DQa pins; Byte bis associated with DQb pins. For the x32 and x36  
versions, Byte ais associated with DQa pins; Byte bis  
associated with DQb pins; Byte cis associated with DQc pins;  
Byte dis associated with DQd pins. Input data must meet setup  
and hold times around the rising edge  
(b) 8, 9, 12,  
(b) 68, 69,  
13, 18, 19, 22, 72-75, 78, 79  
of CLK.  
23  
(c) 2, 3, 6-9,  
12, 13  
DQc  
(d) 18, 19,  
22-25, 28, 29  
DQd  
74  
24  
51  
80  
1
NC/DQPa  
NC/DQPb  
NC/DQPc  
NC/DQPd  
NC/  
I/O  
No Connect/Parity Data I/Os: On the x32 version, these pins are No  
Connect (NC). On the x18 version, Byte aparity is DQPa; Byte b”  
parity is DQPb. On the x36 version, Byte aparity is DQPa; Byte  
bparity is DQPb; Byte cparity is DQPc; Byte dparity is DQPd.  
30  
14, 15, 41, 65, 14, 15, 41, 65,  
91 91  
VDD  
Supply Power Supply: See DC Electrical Characteristics and Operating  
Conditionsforrange.  
4, 11, 20, 27, 4, 11, 20, 27,  
54, 61, 70, 77 54, 61, 70, 77  
VDDQ  
Supply Isolated Output Buffer Supply: See DC Electrical Characteristics and  
OperatingConditionsforrange.  
5, 10, 17, 21, 5, 10, 17, 21,  
26, 40, 55, 60, 26, 40, 55, 60,  
67, 71, 76, 90 67, 71, 76, 90  
V
SS  
Supply Ground:GND.  
38, 39, 42, 43 38, 39, 42, 43  
DNU  
NC  
Do Not Use: These signals may either be unconnected or wired to  
GND to improve package heat dissipation.  
1-3, 6, 7, 16,  
25, 28-30,  
16, 66  
No Connect: These signals are not internally connected and may be  
connectedtogroundtoimprovepackageheatdissipation.  
51-53, 56, 57,  
66, 75, 78, 79,  
95, 96  
50  
50  
NC/SA  
No Connect: This pin is reserved for address expansion.  
2Mb:128Kx18, 64Kx32/36Pipelined, SCDSyncBurstSRAM  
MT58L128L18P_2.p65 Rev. 3/00  
MicronTechnology,Inc.,reservestherighttochangeproductsorspecificationswithoutnotice.  
6
©2000,MicronTechnology,Inc.  

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