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MT58L128L18FT8.5 PDF预览

MT58L128L18FT8.5

更新时间: 2024-02-23 06:36:01
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器内存集成电路
页数 文件大小 规格书
25页 522K
描述
128KX18 STANDARD SRAM, 8.5ns, PQFP100, PLASTIC, MS-026BHA, TQFP-100

MT58L128L18FT8.5 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:QFP包装说明:LQFP,
针数:100Reach Compliance Code:unknown
风险等级:5.25Is Samacsys:N
最长访问时间:8.5 nsJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:2359296 bit内存集成电路类型:STANDARD SRAM
内存宽度:18湿度敏感等级:3
功能数量:1端子数量:100
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX18
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):225
认证状态:Not Qualified座面最大高度:1.6 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN LEAD (800)端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:14 mm
Base Number Matches:1

MT58L128L18FT8.5 数据手册

 浏览型号MT58L128L18FT8.5的Datasheet PDF文件第2页浏览型号MT58L128L18FT8.5的Datasheet PDF文件第3页浏览型号MT58L128L18FT8.5的Datasheet PDF文件第4页浏览型号MT58L128L18FT8.5的Datasheet PDF文件第6页浏览型号MT58L128L18FT8.5的Datasheet PDF文件第7页浏览型号MT58L128L18FT8.5的Datasheet PDF文件第8页 
2Mb : 128K x 18, 64K x 32/36  
FLOW-THROUGH SYNCBURST SRAM  
TQFP PIN DESCRIPTIONS  
x18  
x32/x36  
SYMBOL TYPE  
DESCRIPTION  
37  
36  
37  
36  
SA0  
SA1  
SA  
Input Synchronous Address Inputs: These inputs are registered and must  
meet the setup and hold times around the rising edge of CLK.  
32-35, 44-49, 32-35, 44-49,  
80-82, 99,  
100  
81, 82, 99,  
100  
93  
94  
93  
94  
95  
96  
BWa#  
BWb#  
BWc#  
BWd#  
Input Synchronous Byte Write Enables: These active LOW inputs allow  
individual bytes to be written and must meet the setup and hold  
times around the rising edge of CLK. A byte write enable is LOW  
for a WRITE cycle and HIGH for a READ cycle. For the x18 version,  
BWa# controls DQa pins and DQPa; BWb# controls DQb pins and  
DQPb. For the x32 and x36 versions, BWa# controls DQa pins and  
DQPa; BWb# controls DQb pins and DQPb; BWc# controls DQc pins  
and DQPc; BWd# controls DQd pins and DQPd. Parity is only  
available on the x18 and x36 versions.  
87  
88  
89  
87  
88  
89  
BWE#  
GW#  
CLK  
Input Byte Write Enable: This active LOW input permits BYTE WRITE  
operations and must meet the setup and hold times around the  
rising edge of CLK.  
Input Global Write: This active LOW input allows a full 18-, 32-, or 36-bit  
WRITE to occur independent of the BWE# and BWx# lines and must  
meet the setup and hold times around the rising edge of CLK.  
Input Clock: This signal registers the address, data, chip enable, byte  
write enables and burst control inputs on its rising edge. All  
synchronous inputs must meet setup and hold times around the  
clocks rising edge.  
98  
92  
97  
98  
92  
97  
CE#  
CE2#  
CE2  
Input Synchronous Chip Enable: This active LOW input is used to enable  
the device and conditions the internal use of ADSP#. CE# is sampled  
only when a new external address is loaded.  
Input Synchronous Chip Enable: This active LOW input is used to enable  
the device and is sampled only when a new external address is  
loaded.  
Input Synchronous Chip Enable: This active HIGH input is used to enable  
the device and is sampled only when a new external address is  
loaded.  
86  
83  
86  
83  
OE#  
Input Output Enable: This active LOW, asynchronous input enables the  
data I/O output drivers.  
ADV#  
Input Synchronous Address Advance: This active LOW input is used to  
advance the internal burst counter, controlling burst access after  
the external address is loaded. A HIGH on this pin effectively causes  
wait states to be generated (no address advance). To ensure use of  
correct address during a WRITE cycle, ADV# must be HIGH at the  
rising edge of the first clock after an ADSP# cycle is initiated.  
84  
84  
ADSP#  
Input Synchronous Address Status Processor: This active LOW input  
interrupts any ongoing burst, causing a new external address to be  
registered. A READ is performed using the new address,  
independent of the byte write enables and ADSC#, but dependent  
upon CE#, CE2 and CE2#. ADSP# is ignored if CE# is HIGH. Power-  
down state is entered if CE2 is LOW or CE2# is HIGH.  
(continued on next page)  
2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM  
MT58L128L18F_2.p65 Rev. 7/00  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
5
©2000,MicronTechnology,Inc.  

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