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MT54W1MH18BF-7.5 PDF预览

MT54W1MH18BF-7.5

更新时间: 2024-11-09 20:41:19
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
27页 397K
描述
QDR SRAM, 1MX18, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165

MT54W1MH18BF-7.5 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:TBGA,针数:165
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.67
最长访问时间:0.5 ns其他特性:PIPELINED ARCHITECTURE
JESD-30 代码:R-PBGA-B165JESD-609代码:e0
长度:15 mm内存密度:18874368 bit
内存集成电路类型:QDR SRAM内存宽度:18
湿度敏感等级:3功能数量:1
端子数量:165字数:1048576 words
字数代码:1000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX18封装主体材料:PLASTIC/EPOXY
封装代码:TBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):220认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN LEAD
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:13 mmBase Number Matches:1

MT54W1MH18BF-7.5 数据手册

 浏览型号MT54W1MH18BF-7.5的Datasheet PDF文件第2页浏览型号MT54W1MH18BF-7.5的Datasheet PDF文件第3页浏览型号MT54W1MH18BF-7.5的Datasheet PDF文件第4页浏览型号MT54W1MH18BF-7.5的Datasheet PDF文件第5页浏览型号MT54W1MH18BF-7.5的Datasheet PDF文件第6页浏览型号MT54W1MH18BF-7.5的Datasheet PDF文件第7页 
2 MEG X 8, 1 MEG X 18, 512K X 36  
1.8V VDD, HSTL, QDRIIb2 SRAM  
MT54W2MH8B  
MT54W1MH18B  
MT54W512H36B  
18Mb QDRII SRAM  
2-WORD BURST  
Features  
Figure 1: 165-Ball FBGA  
DLL circuitry for accurate output data placement  
Separate independent read and write data ports with  
concurrent transactions  
100 percent bus utilization DDR READ and WRITE  
operation  
Fast clock to valid data times  
Full data coherency, providing most current data  
Two-tick burst counter for low DDR transaction size  
Double data rate operation on read and write ports  
Two input clocks (K and K#) for precise DDR timing at  
clock rising edges only  
Two output clocks (C and C#) for precise flight time  
and clock skew matching—clock and data delivered  
together to receiving device  
Optional-use echo clocks (CQ and CQ#) for flexible  
receive data synchronization  
Table 1:  
Valid Part Numbers  
Single address bus  
Simple control logic for easy depth expansion  
Internally self-timed, registered writes  
Core VDD = 1.8V ( 0.1V); I/O VDDQ = 1.5V to VDD  
( 0.1V) HSTL  
Clock-stop capability with µs restart  
13mm x 15mm, 1mm pitch, 11 x 15 grid FBGA package  
User-programmable impedance output  
JTAG boundary scan  
PART NUMBER  
DESCRIPTION  
MT54W2MH8BF-xx  
MT54W1MH18BF-xx  
MT54W512H36BF-xx  
2 Meg x 8, QDRIIb2 FBGA  
1 Meg x 18, QDRIIb2 FBGA  
512K x 36, QDRIIb2 FBGA  
General Description  
The Micron® QDR™II (Quad Data Rate™) synchro-  
nous, pipelined burst SRAM employs high-speed, low-  
power CMOS designs using an advanced 6T CMOS  
process.  
Options  
Marking1  
Clock Cycle Timing  
4ns (250 MHz)  
5ns (200 MHz)  
6ns (167 MHz)  
7.5ns (133 MHz)  
Configurations  
2 Meg x 8  
1 Meg x 18  
512K x 36  
Package  
-4  
-5  
-6  
The QDR architecture consists of two separate DDR  
(double data rate) ports to access the memory array.  
The read port has dedicated data outputs to support  
READ operations. The write port has dedicated data  
inputs to support WRITE operations. This architecture  
eliminates the need for high-speed bus turnaround.  
Access to each port is accomplished using a common  
address bus. Addresses for reads and writes are latched  
on rising edges of the K and K# input clocks, respec-  
tively. Each address location is associated with two  
words that burst sequentially into or out of the device.  
Since data can be transferred into and out of the device  
on every rising edge of both clocks (K and K# and C  
and C#), memory bandwidth is maximized and system  
design is simplified by eliminating bus turnarounds.  
-7.5  
MT54W2MH8B  
MT54W1MH18B  
MT54W512H36B  
165-ball, 13mm x 15mm FBGA  
Operating Temperature Range  
Commercial (0°C ? TA ? +70°C)  
F
None  
NOTE:  
1. A Part Marking Guide for the FBGA devices can be found on  
Micron’s Web site—http://www.micron.com/numberguide.  
18Mb: 1.8V VDD, HSTL, QDRIIb2 SRAM  
MT54W1MH18B_H.fm – Rev. H, Pub. 3/03  
1
©2003 Micron Technology, Inc.  

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