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MSP430FG4250IRGZR PDF预览

MSP430FG4250IRGZR

更新时间： 2024-10-16 05:21:47
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路装置时钟
页数 文件大小 规格书
65页 1336K
描述
MIXED SIGNAL MICROCONTROLLER

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中文翻译

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MSP430FG4250IRGZR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：QFN
包装说明：QFN-48针数：48
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.31.00.01Factory Lead Time：12 weeks
风险等级：1.09Is Samacsys：N
具有ADC：YES其他特性：ALSO OPERATES AT 2.5V MINIMUM SUPPLY
地址总线宽度：位大小：16
边界扫描：YESCPU系列：MSP430
最大时钟频率：8 MHzDAC 通道：YES
DMA 通道：NO外部数据总线宽度：
格式：FIXED POINT集成缓存：NO
JESD-30 代码：S-PQCC-N48JESD-609代码：e4
长度：7 mm低功率模式：YES
湿度敏感等级：3DMA 通道数量：
外部中断装置数量：I/O 线路数量：32
串行 I/O 数：端子数量：48
计时器数量：4片上数据RAM宽度：8
片上程序ROM宽度：8最高工作温度：85 °C
最低工作温度：-40 °CPWM 通道：YES
封装主体材料：PLASTIC/EPOXY封装代码：HVQCCN
封装等效代码：LCC48,.27SQ,20封装形状：SQUARE
封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度（摄氏度）：260
电源：2/3.3 V认证状态：Not Qualified
RAM（字节）：256RAM（字数）：0.25
ROM（单词）：16384ROM可编程性：FLASH
座面最大高度：1 mm速度：8 MHz
子类别：Microcontrollers最大压摆率：0.52 mA
最大供电电压：3.6 V最小供电电压：1.8 V
标称供电电压：3 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：NO LEAD
端子节距：0.5 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：7 mm
uPs/uCs/外围集成电路类型：MICROCONTROLLER, RISCBase Number Matches：1

MSP430FG4250IRGZR 数据手册

 浏览型号MSP430FG4250IRGZR的Datasheet PDF文件第2页浏览型号MSP430FG4250IRGZR的Datasheet PDF文件第3页浏览型号MSP430FG4250IRGZR的Datasheet PDF文件第4页浏览型号MSP430FG4250IRGZR的Datasheet PDF文件第5页浏览型号MSP430FG4250IRGZR的Datasheet PDF文件第6页浏览型号MSP430FG4250IRGZR的Datasheet PDF文件第7页 
MSP430FG42x0  
MIXED SIGNAL MICROCONTROLLER  
SLAS556A − JULY 2007 − REVISED AUGUST 2007  
D
D
Low Supply-Voltage Range, 1.8 V to 3.6 V  
D
Serial Onboard Programming,  
No External Programming Voltage Needed  
Programmable Code Protection by Security  
Fuse  
Ultralow-Power Consumption:  
Active Mode: 250 μA at 1 MHz, 2.2 V  
Standby Mode: 1.1 μA  
Off Mode (RAM Retention): 0.1 μA  
D
D
Integrated LCD Driver With Contrast  
Control for up to 56 Segments  
D
D
Five Power Saving Modes  
MSP430FG42x0 Family Members Include:  
MSP430FG4250: 16KB+256B Flash Memory  
256B RAM  
MSP430FG4260: 24KB+256B Flash Memory  
256B RAM  
Wake-Up From Standby Mode in Less  
Than 6 μs  
D
D
16-Bit RISC Architecture,  
125-ns Instruction Cycle Time  
16-Bit Sigma-Delta A/D Converter With  
Internal Reference and Five Differential  
Analog Inputs  
MSP430FG4270: 32KB+256B Flash Memory  
256B RAM  
D
D
For Complete Module Descriptions, See  
MSP430x4xx Family User’s Guide,  
Literature Number SLAU056  
D
D
D
12-Bit D/A Converter  
Two Configurable Operational Amplifiers  
16-Bit Timer_A With Three  
Capture/Compare Registers  
For Additional Device Information, See  
MSP430FG42x0 Device Erratasheet,  
Literature Number SLAZ038  
D
D
Brownout Detector  
Bootstrap Loader  
description  
The Texas Instruments MSP430 family of ultralow-power microcontrollers consist of several devices featuring  
different sets of peripherals targeted for various applications. The architecture, combined with five low-power  
modes, is optimized to achieve extended battery life in portable measurement applications. The device features  
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code  
efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less  
than 6 μs.  
The MSP430FG42x0 is a microcontroller configuration with a 16-bit timer, a high-performance 16-bit  
sigma-delta A/D converter, 12-bit D/A converter, two configurable operational amplifiers, 32 I/O pins, and a liquid  
crystal display driver.  
Typical applications for this device include analog and digital sensor systems, digital motor control, remote  
controls, thermostats, digital timers, hand-held meters, etc.  
AVAILABLE OPTIONS  
PACKAGED DEVICES  
T
A
PLASTIC 48-PIN SSOP  
(DL)  
PLASTIC 48-PIN QFN  
(RGZ)  
MSP430FG4250IDL  
MSP430FG4260IDL  
MSP430FG4270IDL  
MSP430FG4250IRGZ  
MSP430FG4260IRGZ  
MSP430FG4270IRGZ  
−40°C to 85°C  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range  
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage  
because very small parametric changes could cause the device not to meet its published specifications. These devices have limited  
built-in ESD protection.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2007, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...65

中文翻译

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MSP430FG4250IRGZR 替代型号

型号 品牌 替代类型 描述 数据表
MSP430FG4250IRGZT TI

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