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MSP430F5631IZQWR PDF预览

MSP430F5631IZQWR

更新时间: 2024-12-01 11:58:15
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路时钟
页数 文件大小 规格书
107页 1246K
描述
MIXED SIGNAL MICROCONTROLLER

MSP430F5631IZQWR 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:VFBGA, BGA113,12X12,20
针数:113Reach Compliance Code:compliant
ECCN代码:3A991.A.2HTS代码:8542.31.00.01
Factory Lead Time:17 weeks风险等级:5.76
具有ADC:NO其他特性:ALSO OPERATES 1.8V AT 8 MHZ
地址总线宽度:位大小:16
CPU系列:MSP430最大时钟频率:32 MHz
DAC 通道:NODMA 通道:YES
外部数据总线宽度:JESD-30 代码:S-PBGA-B113
JESD-609代码:e1长度:7 mm
湿度敏感等级:3I/O 线路数量:74
端子数量:113片上程序ROM宽度:8
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA封装等效代码:BGA113,12X12,20
封装形状:SQUARE封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:2/3.3 V
认证状态:Not QualifiedRAM(字节):18432
ROM(单词):196608ROM可编程性:FLASH
座面最大高度:1 mm速度:20 MHz
子类别:Microcontrollers最大供电电压:3.6 V
最小供电电压:2.4 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

MSP430F5631IZQWR 数据手册

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MSP430F563x  
www.ti.com  
SLAS650C JUNE 2010REVISED AUGUST 2012  
MIXED SIGNAL MICROCONTROLLER  
1
FEATURES  
2
Low Supply Voltage Range: 1.8 V to 3.6 V  
Capture/Compare Registers  
Ultralow Power Consumption  
Two Universal Serial Communication  
Interfaces  
Active Mode (AM):  
All System Clocks Active:  
270 µA/MHz at 8 MHz, 3.0 V, Flash Program  
Execution (Typical)  
USCI_A0 and USCI_A1 Each Support:  
Enhanced UART Supports Auto-  
Baudrate Detection  
Standby Mode (LPM3):  
IrDA Encoder and Decoder  
Synchronous SPI  
Watchdog With Crystal, and Supply  
Supervisor Operational, Full RAM  
Retention, Fast Wake-Up:  
USCI_B0 and USCI_B1 Each Support:  
I2CTM  
1.8 µA at 2.2 V, 2.1 µA at 3.0 V (Typical)  
Synchronous SPI  
Shutdown RTC Mode (LPM3.5):  
Shutdown Mode, Active Real-Time Clock  
With Crystal:  
Full-Speed Universal Serial Bus (USB)  
Integrated USB-PHY  
1.1 µA at 3.0 V (Typical)  
Integrated 3.3-V and 1.8-V USB Power  
System  
Shutdown Mode (LPM4.5):  
0.3 µA at 3.0 V (Typical)  
Integrated USB-PLL  
Wake-Up From Standby Mode in 3 µs (Typical)  
Eight Input and Eight Output Endpoints  
16-Bit RISC Architecture, Extended Memory,  
up to 20-MHz System Clock  
12-Bit Analog-to-Digital (A/D) Converter With  
Internal Shared Reference, Sample-and-Hold,  
and Autoscan Feature  
Flexible Power Management System  
Fully Integrated LDO With Programmable  
Regulated Core Supply Voltage  
Dual 12-Bit Digital-to-Analog (D/A) Converters  
With Synchronization  
Supply Voltage Supervision, Monitoring,  
and Brownout  
Voltage Comparator  
Hardware Multiplier Supporting 32-Bit  
Operations  
Unified Clock System  
FLL Control Loop for Frequency  
Stabilization  
Serial Onboard Programming, No External  
Programming Voltage Needed  
Low-Power Low-Frequency Internal Clock  
Source (VLO)  
Six-Channel Internal DMA  
Real-Time Clock Module With Supply Voltage  
Backup Switch  
Low-Frequency Trimmed Internal Reference  
Source (REFO)  
Family Members are Summarized in Table 1  
32-kHz Crystals (XT1)  
For Complete Module Descriptions, See the  
MSP430x5xx and MSP430x6xx Family User's  
Guide (SLAU208)  
High-Frequency Crystals Up to 32 MHz  
(XT2)  
Four 16-Bit Timer With 3, 5, or 7  
DESCRIPTION  
The Texas Instruments MSP430 family of ultralow-power microcontrollers consists of several devices featuring  
different sets of peripherals targeted for various applications. The architecture, combined with five low-power  
modes, is optimized to achieve extended battery life in portable measurement applications. The device features a  
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.  
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in 3 µs (typical).  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2010–2012, Texas Instruments Incorporated  

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