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MSP430F5510IRGCR PDF预览

MSP430F5510IRGCR

更新时间: 2024-12-01 10:44:51
品牌 Logo 应用领域
德州仪器 - TI 微控制器
页数 文件大小 规格书
110页 1337K
描述
MIXED SIGNAL MICROCONTROLLER

MSP430F5510IRGCR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN, LCC64,.35SQ,20针数:64
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.31.00.01Factory Lead Time:6 weeks
风险等级:1.06具有ADC:YES
其他特性:OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ地址总线宽度:
位大小:16边界扫描:YES
CPU系列:MSP430最大时钟频率:32 MHz
DAC 通道:NODMA 通道:YES
外部数据总线宽度:格式:FIXED-POINT
集成缓存:NOJESD-30 代码:S-PQCC-N64
JESD-609代码:e4长度:9 mm
低功率模式:YES湿度敏感等级:3
DMA 通道数量:3外部中断装置数量:
I/O 线路数量:47串行 I/O 数:2
端子数量:64计时器数量:4
片上数据RAM宽度:16片上程序ROM宽度:8
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:HVQCCN封装等效代码:LCC64,.35SQ,20
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:2/3.3 V
认证状态:Not QualifiedRAM(字节):4096
RAM(字数):2048ROM(单词):32768
ROM可编程性:FLASH座面最大高度:1 mm
速度:25 MHz子类别:Microcontrollers
最大压摆率:6.5 mA最大供电电压:3.6 V
最小供电电压:2.4 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:9 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

MSP430F5510IRGCR 数据手册

 浏览型号MSP430F5510IRGCR的Datasheet PDF文件第2页浏览型号MSP430F5510IRGCR的Datasheet PDF文件第3页浏览型号MSP430F5510IRGCR的Datasheet PDF文件第4页浏览型号MSP430F5510IRGCR的Datasheet PDF文件第5页浏览型号MSP430F5510IRGCR的Datasheet PDF文件第6页浏览型号MSP430F5510IRGCR的Datasheet PDF文件第7页 
MSP430F550x, MSP430F5510  
www.ti.com  
SLAS645F JULY 2009REVISED MARCH 2011  
MIXED SIGNAL MICROCONTROLLER  
1
FEATURES  
Low Supply-Voltage Range, 1.8 V to 3.6 V  
16-Bit Timer TA0, Timer_A With Five  
Capture/Compare Registers  
Ultra-Low Power Consumption  
16-Bit Timer TA1, Timer_A With Three  
Capture/Compare Registers  
Active Mode (AM)  
All System Clocks Active  
16-Bit Timer TA2, Timer_A With Three  
Capture/Compare Registers  
195 µA/MHz at 8 MHz, 3 V, Flash  
Program Execution (Typical)  
16-Bit Timer TB0, Timer_B With Seven  
Capture/Compare Shadow Registers  
115 µA/MHz at 8 MHz, 3 V, RAM Program  
Execution (Typical)  
Two Universal Serial Communication  
Interfaces  
Standby Mode (LPM3)  
Real Time Clock With Crystal,  
Watchdog, and Supply Supervisor  
Operational, Full RAM Retention, Fast  
Wake-Up:  
USCI_A0 and USCI_A1 Each Supporting  
Enhanced UART Supporting  
Auto-Baudrate Detection  
1.9 µA at 2.2 V, 2.1 µA at 3 V (Typical)  
IrDA Encoder and Decoder  
Synchronous SPI  
Low-Power Oscillator (VLO),  
General-Purpose Counter, Watchdog,  
and Supply Supervisor Operational, Full  
RAM Retention, Fast Wake-Up:  
1.4 µA at 3 V (Typical)  
USCI_B0 and USCI_B1 Each Supporting  
I2CTM  
Synchronous SPI  
Full-Speed Universal Serial Bus (USB)  
Off Mode (LPM4)  
Full RAM Retention, Supply Supervisor  
Operational, Fast Wake-Up:  
1.1 µA at 3 V (Typical)  
Integrated USB-PHY  
Integrated 3.3-V/1.8-V USB Power System  
Integrated USB-PLL  
Shutdown Mode (LPM4.5)  
0.18 µA at 3 V (Typical)  
Eight Input, Eight Output Endpoints  
10-Bit Analog-to-Digital (A/D) Converter With  
Window Comparator  
Wake-Up From Standby in Less Than 5 µs  
16-Bit RISC Architecture, Extended Memory,  
Up to 25-MHz System Clock  
Comparator  
Hardware Multiplier Supporting 32-Bit  
Operations  
Flexible Power Management System  
Fully Integrated LDO With Programmable  
Regulated Core Supply Voltage  
Serial Onboard Programming, No External  
Programming Voltage Needed  
Supply Voltage Supervision, Monitoring,  
and Brownout  
Three Channel Internal DMA  
Basic Timer With Real Time Clock Feature  
Family Members are Summarized in Table 1  
Unified Clock System  
FLL Control Loop for Frequency  
Stabilization  
For Complete Module Descriptions, See the  
MSP430x5xx/MSP430x6xx Family User's Guide  
(SLAU208)  
Low-Power Low-Frequency Internal Clock  
Source (VLO)  
Low-Frequency Trimmed Internal Reference  
Source (REFO)  
32-kHz Watch Crystals (XT1)  
High-Frequency Crystals up to 32 MHz  
(XT2)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 20092011, Texas Instruments Incorporated  

MSP430F5510IRGCR 替代型号

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