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MSP430F5513IRGCT PDF预览

MSP430F5513IRGCT

更新时间： 2024-12-01 05:50:27
品牌 Logo 应用领域
德州仪器 - TI 微控制器
页数 文件大小 规格书
115页 1126K
描述
MIXED SIGNAL MICROCONTROLLER

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MSP430F5513IRGCT 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：QFN
包装说明：HVQCCN, LCC64,.35SQ,20针数：64
Reach Compliance Code：compliantECCN代码：3A991.A.2
HTS代码：8542.31.00.01Factory Lead Time：1 week
风险等级：5.48具有ADC：YES
其他特性：ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ地址总线宽度：
位大小：16CPU系列：MSP430
最大时钟频率：32 MHzDAC 通道：NO
DMA 通道：YES外部数据总线宽度：
JESD-30 代码：S-PQCC-N64JESD-609代码：e4
长度：9 mm湿度敏感等级：3
I/O 线路数量：47端子数量：64
最高工作温度：85 °C最低工作温度：-40 °C
PWM 通道：YES封装主体材料：PLASTIC/EPOXY
封装代码：HVQCCN封装等效代码：LCC64,.35SQ,20
封装形状：SQUARE封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：260电源：2/3.3 V
认证状态：Not QualifiedRAM（字节）：4096
ROM（单词）：32768ROM可编程性：FLASH
座面最大高度：1 mm速度：25 MHz
子类别：Microcontrollers最大压摆率：11 mA
最大供电电压：3.6 V最小供电电压：2.4 V
标称供电电压：3 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：NO LEAD
端子节距：0.5 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：9 mm
uPs/uCs/外围集成电路类型：MICROCONTROLLER, RISCBase Number Matches：1

MSP430F5513IRGCT 数据手册

 浏览型号MSP430F5513IRGCT的Datasheet PDF文件第2页浏览型号MSP430F5513IRGCT的Datasheet PDF文件第3页浏览型号MSP430F5513IRGCT的Datasheet PDF文件第4页浏览型号MSP430F5513IRGCT的Datasheet PDF文件第5页浏览型号MSP430F5513IRGCT的Datasheet PDF文件第6页浏览型号MSP430F5513IRGCT的Datasheet PDF文件第7页 
MSP430F551x  
MSP430F552x  
www.ti.com  
SLAS590D –OCTOBER 2009–REVISED APRIL 2010  
MIXED SIGNAL MICROCONTROLLER  
1
FEATURES  
•
Low Supply-Voltage Range: 1.8 V to 3.6 V  
•
•
•
•
•
16-Bit Timer TA0, Timer_A With Five  
Capture/Compare Registers  
•
Ultralow Power Consumption  
16-Bit Timer TA1, Timer_A With Three  
Capture/Compare Registers  
–
Active Mode (AM):  
All System Clocks Active  
290 µA/MHz at 8 MHz, 3.0 V, Flash Program  
Execution (Typical)  
150 µA/MHz at 8 MHz, 3.0 V, RAM Program  
Execution (Typical)  
16-Bit Timer TA2, Timer_A With Three  
Capture/Compare Registers  
16-Bit Timer TB0, Timer_B With Seven  
Capture/Compare Shadow Registers  
–
Standby Mode (LPM3):  
Two Universal Serial Communication  
Interfaces  
Real Time Clock With Crystal , Watchdog,  
and Supply Supervisor Operational, Full  
RAM Retention, Fast Wake-Up:  
1.9 µA at 2.2 V, 2.1 µA at 3.0 V (Typical)  
Low-Power Oscillator (VLO),  
General-Purpose Counter, Watchdog, and  
Supply Supervisor Operational, Full RAM  
Retention, Fast Wake-Up:  
–
–
USCI_A0 and USCI_A1 Each Supporting  
–
Enhanced UART supporting  
Auto-Baudrate Detection  
–
–
IrDA Encoder and Decoder  
Synchronous SPI  
USCI_B0 and USCI_B1 Each Supporting  
1.4 µA at 3.0 V (Typical)  
–
–
I2CTM  
–
–
Off Mode (LPM4):  
Synchronous SPI  
Full RAM Retention, Supply Supervisor  
Operational, Fast Wake-Up:  
1.1 µA at 3.0 V (Typical)  
•
•
Full-Speed Universal Serial Bus (USB)  
–
–
–
–
Integrated USB-PHY  
Integrated 3.3-V/1.8-V USB Power System  
Integrated USB-PLL  
Shutdown Mode (LPM4.5):  
0.18 µA at 3.0 V (Typical)  
•
•
•
Wake-Up From Standby Mode in Less Than  
5 µs  
Eight Input, Eight Output Endpoints  
12-Bit Analog-to-Digital (A/D) Converter  
(MSP430F552x Only) With Internal Reference,  
Sample-and-Hold, and Autoscan Feature  
16-Bit RISC Architecture, Extended Memory,  
up to 25-MHz System Clock  
Flexible Power Management System  
•
•
Comparator  
–
Fully Integrated LDO With Programmable  
Regulated Core Supply Voltage  
Hardware Multiplier Supporting 32-Bit  
Operations  
–
Supply Voltage Supervision, Monitoring,  
and Brownout  
•
Serial Onboard Programming, No External  
Programming Voltage Needed  
•
Unified Clock System  
•
•
•
•
Three Channel Internal DMA  
–
–
–
FLL Control Loop for Frequency  
Stabilization  
Basic Timer With Real-Time Clock Feature  
Family Members are Summarized in Table 1  
Low Power/Low Frequency Internal Clock  
Source (VLO)  
For Complete Module Descriptions, See the  
MSP430x5xx Family User's Guide (SLAU208)  
Low Frequency Trimmed Internal Reference  
Source (REFO)  
–
–
32-kHz Watch Crystals (XT1)  
High-Frequency Crystals up to 32 MHz  
(XT2)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2010, Texas Instruments Incorporated  
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