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MSP430F5418AIPNR PDF预览

MSP430F5418AIPNR

更新时间: 2024-11-18 05:50:27
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路装置PC时钟
页数 文件大小 规格书
99页 822K
描述
MIXED SIGNAL MICROCONTROLLER

MSP430F5418AIPNR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFP
包装说明:LFQFP, QFP80,.55SQ,20针数:80
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.31.00.01风险等级:0.8
Samacsys Confidence:Samacsys Status:Released
Samacsys PartID:606441Samacsys Pin Count:80
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Other
Samacsys Footprint Name:QFP50P1400X1400X160-80NSamacsys Released Date:2017-01-12 12:59:53
Is Samacsys:N具有ADC:YES
其他特性:ITS ALSO OPERATES MINIMUM 1.8V AT 12MHZ地址总线宽度:
位大小:16边界扫描:YES
CPU系列:MSP430最大时钟频率:18 MHz
DAC 通道:NODMA 通道:YES
外部数据总线宽度:格式:FIXED POINT
集成缓存:NOJESD-30 代码:S-PQFP-G80
JESD-609代码:e4长度:12 mm
低功率模式:YES湿度敏感等级:3
DMA 通道数量:3外部中断装置数量:
I/O 线路数量:67串行 I/O 数:3
端子数量:80计时器数量:15
片上数据RAM宽度:8片上程序ROM宽度:8
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LFQFP封装等效代码:QFP80,.55SQ,20
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:2/3.3 V
认证状态:Not QualifiedRAM(字节):16384
RAM(字数):16ROM(单词):131072
ROM可编程性:FLASH座面最大高度:1.6 mm
速度:25 MHz子类别:Microcontrollers
最大压摆率:9.6 mA最大供电电压:3.6 V
最小供电电压:2.2 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:12 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

MSP430F5418AIPNR 数据手册

 浏览型号MSP430F5418AIPNR的Datasheet PDF文件第2页浏览型号MSP430F5418AIPNR的Datasheet PDF文件第3页浏览型号MSP430F5418AIPNR的Datasheet PDF文件第4页浏览型号MSP430F5418AIPNR的Datasheet PDF文件第5页浏览型号MSP430F5418AIPNR的Datasheet PDF文件第6页浏览型号MSP430F5418AIPNR的Datasheet PDF文件第7页 
MSP430F543x, MSP430F541x  
www.ti.com  
SLAS612C AUGUST 2009REVISED MARCH 2010  
MIXED SIGNAL MICROCONTROLLER  
1
FEATURES  
Low Supply Voltage Range: 2.2 V to 3.6 V  
16-Bit Timer TA0, Timer_A With Five  
Capture/Compare Registers  
Ultralow Power Consumption  
16-Bit Timer TA1, Timer_A With Three  
Capture/Compare Registers  
Active Mode (AM):  
All System Clocks Active  
312 µA/MHz at 8 MHz, 3.0 V, Flash Program  
Execution (Typical)  
140 µA/MHz at 8 MHz, 3.0 V, RAM Program  
Execution (Typical)  
16-Bit Timer TB0, Timer_B With Seven  
Capture/Compare Shadow Registers  
Up to Four Universal Serial Communication  
Interfaces  
Standby Mode (LPM3):  
USCI_A0, USCI_A1, USCI_A2, and USCI_A3  
Each Supporting  
Real-Time Clock With Crystal , Watchdog,  
and Supply Supervisor Operational, Full  
RAM Retention, Fast Wake-Up:  
2.6 µA at 3.0 V (Typical)  
Enhanced UART supporting  
Auto-Baudrate Detection  
IrDA Encoder and Decoder  
Synchronous SPI  
Low-Power Oscillator (VLO),  
General-Purpose Counter, Watchdog, and  
Supply Supervisor Operational, Full RAM  
Retention, Fast Wake-Up:  
USCI_B0, USCI_B1, USCI_B2, and USCI_B3  
Each Supporting  
I2CTM  
1.8 µA at 3.0 V (Typical)  
Off Mode (LPM4):  
Synchronous SPI  
Full RAM Retention, Supply Supervisor  
Operational, Fast Wake-Up:  
1.69 µA at 3.0 V (Typical)  
12-Bit Analog-to-Digital (A/D) Converter  
Internal Reference  
Sample-and-Hold  
Wake-Up From Standby Mode in Less Than  
5 µs  
Autoscan Feature  
14 External Channels, 2 Internal Channels  
16-Bit RISC Architecture  
Hardware Multiplier Supporting 32-Bit  
Operations  
Extended Memory  
Up to 18-MHz System Clock  
Serial Onboard Programming, No External  
Programming Voltage Needed  
Flexible Power Management System  
Fully Integrated LDO With Programmable  
Regulated Core Supply Voltage  
Three Channel Internal DMA  
Basic Timer With Real-Time Clock Feature  
Family Members are Summarized in Table 1  
Supply Voltage Supervision, Monitoring,  
and Brownout  
For Complete Module Descriptions, See the  
MSP430x5xx Family User's Guide (SLAU208)  
Unified Clock System  
FLL Control Loop for Frequency  
Stabilization  
Low-Power/Low-Frequency Internal Clock  
Source (VLO)  
Low-Frequency Trimmed Internal Reference  
Source (REFO)  
32-kHz Crystals  
High-Frequency Crystals up to 32 MHz  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
UNLESS OTHERWISE NOTED this document contains  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2010, Texas Instruments Incorporated  

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