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MSP430F4361IPZ PDF预览

MSP430F4361IPZ

更新时间： 2024-11-04 03:57:31
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路时钟
页数 文件大小 规格书
73页 1180K
描述
MIXED SIGNAL MICROCONTROLLER

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MSP430F4361IPZ 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Obsolete零件包装代码：QFP
包装说明：GREEN, PLASTIC, LQFP-100针数：100
Reach Compliance Code：compliantHTS代码：8542.31.00.01
Factory Lead Time：1 week风险等级：7.71
Is Samacsys：N具有ADC：YES
其他特性：ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ地址总线宽度：
位大小：16CPU系列：MSP430
最大时钟频率：8 MHzDAC 通道：NO
DMA 通道：NO外部数据总线宽度：
JESD-30 代码：S-PQFP-G100JESD-609代码：e4
长度：14 mm湿度敏感等级：3
I/O 线路数量：48端子数量：100
最高工作温度：85 °C最低工作温度：-40 °C
PWM 通道：YES封装主体材料：PLASTIC/EPOXY
封装代码：LFQFP封装等效代码：QFP100,.63SQ,20
封装形状：SQUARE封装形式：FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）：260电源：2/3.3 V
认证状态：Not QualifiedRAM（字节）：1024
ROM（单词）：24576ROM可编程性：FLASH
座面最大高度：1.6 mm速度：8 MHz
子类别：Microcontrollers最大压摆率：0.56 mA
最大供电电压：3.6 V最小供电电压：2.7 V
标称供电电压：3 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.5 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：14 mm
uPs/uCs/外围集成电路类型：MICROCONTROLLER, RISCBase Number Matches：1

MSP430F4361IPZ 数据手册

 浏览型号MSP430F4361IPZ的Datasheet PDF文件第2页浏览型号MSP430F4361IPZ的Datasheet PDF文件第3页浏览型号MSP430F4361IPZ的Datasheet PDF文件第4页浏览型号MSP430F4361IPZ的Datasheet PDF文件第5页浏览型号MSP430F4361IPZ的Datasheet PDF文件第6页浏览型号MSP430F4361IPZ的Datasheet PDF文件第7页 
MSP430x43x1, MSP430x43x, MSP430x44x  
MIXED SIGNAL MICROCONTROLLER  
SLAS344F − JANUARY 2002 − REVISED MAY 2007  
D
D
Low Supply-Voltage Range, 1.8 V to 3.6 V  
D
D
Serial Onboard Programming,  
No External Programming Voltage Needed  
Programmable Code Protection by Security  
Fuse  
Ultralow-Power Consumption:  
− Active Mode: 280 μA at 1 MHz, 2.2 V  
− Standby Mode: 1.1 μA  
− Off Mode (RAM Retention): 0.1 μA  
Integrated LCD Driver for up to  
160 Segments  
D
D
D
D
Five Power Saving Modes  
D
Bootstrap Loader  
Wake-Up From Standby Mode in Less  
Than 6 μs  
D
Family Members Include:  
− MSP430F435, MSP430F4351 :  
§
16-Bit RISC Architecture,  
125-ns Instruction Cycle Time  
16KB+256B Flash Memory,  
512B RAM  
12-Bit A/D Converter With Internal  
Reference, Sample-and-Hold and  
Autoscan Feature  
§
− MSP430F436, MSP430F4361 :  
24KB+256B Flash Memory,  
1KB RAM  
†
‡
D
D
16-Bit Timer_B With Three or Seven  
§
− MSP430F437, MSP430F4371 :  
Capture/Compare-With-Shadow Registers  
32KB+256B Flash Memory,  
1KB RAM  
− MSP430F447:  
16-Bit Timer_A With Three  
Capture/Compare Registers  
32KB+256B Flash Memory,  
1KB RAM  
− MSP430F448:  
48KB+256B Flash Memory,  
2KB RAM  
− MSP430F449:  
D
On-Chip Comparator  
D
Serial Communication Interface (USART),  
Select Asynchronous UART or  
Synchronous SPI by Software:  
− Two USARTs (USART0, USART1) —  
MSP430x44x Devices  
60KB+256B Flash Memory,  
2KB RAM  
− One USART (USART0) —  
MSP430x43x(1) Devices  
D
For Complete Module Descriptions, See  
The MSP430x4xx Family User’s Guide,  
Literature Number SLAU056  
D
D
Brownout Detector  
Supply Voltage Supervisor/Monitor With  
Programmable Level Detection  
†
‡
§
’F435, ’F436, and ’F437 devices  
’F447, ’F448, and ’F449 devices  
The MSP430F43x1 devices are identical to the MSP430F43x  
devices with the exception that the ADC12 module is not  
implemented.  
description  
The Texas Instruments MSP430 family of ultralow power microcontrollers consists of several devices featuring  
different sets of peripherals targeted for various applications. The architecture, combined with five low-power  
modes, is optimized to achieve extended battery life in portable measurement applications. The device features  
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code  
efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less  
than 6 μs.  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range  
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage  
because very small parametric changes could cause the device not to meet its published specifications. These devices have limited  
built-in ESD protection.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2002−2007, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...73

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