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MSP03

更新时间： 2024-11-14 22:29:51
品牌 Logo 应用领域
威世 - VISHAY 电阻器网络膜电阻器
页数 文件大小 规格书
4页 36K
描述
Thick Film Resistor Networks Single-In-Line, Molded SIP 01, 03, 05 Schematics 6, 8, 9 or 10 Pin A Profile and 6, 8 or 10 Pin C Profile

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MSP03 数据手册

 浏览型号MSP03的Datasheet PDF文件第2页浏览型号MSP03的Datasheet PDF文件第3页浏览型号MSP03的Datasheet PDF文件第4页 
MSP  
Vishay Dale  
Thick Film Resistor Networks  
Single-In-Line, Molded SIP; 01, 03, 05 Schematics  
6, 8, 9 or 10 Pin "A" Profile and 6, 8 or 10 Pin "C" Profile  
FEATURES  
• 0.195" [4.95mm] "A" or 0.350" [8.89mm] "C" maximum seated  
height  
• Highly stable thick film  
• Low temperature coefficient (- 55°C to + 125°C) ± 100ppm/°C  
• Rugged, molded case construction  
• Reduces total assembly costs  
• Compatible with automatic insertion equipment and reduces PC  
board space  
• Wide resistance range  
• Available in tube pack or side-by-side pack  
STANDARD ELECTRICAL SPECIFICATIONS  
MODEL/  
SCHEMATIC  
PROFILE  
RESISTOR  
POWER RATING  
Max. @ 70°C*  
W
RESISTANCE  
RANGE  
STANDARD TEMPERATURE  
TCR  
TRACKING*  
OPERATING  
VOLTAGE  
Max.  
TOLERANCE  
COEFFICIENT  
(- 55°C to + 125°C) (- 55°C to + 125°C)  
Ω
± %  
ppm/°C  
ppm/°C  
VDC  
MSP01  
MSP03  
MSP05  
A
C
0.20  
0.25  
10 - 2.2M  
2 Standard  
(1, 5, 10, 20)**  
± 100  
± 50ppm/°C  
100  
100  
100  
A
C
0.30  
0.40  
10 - 2.2M  
10 - 2.2M  
2 Standard  
(1, 5, 10, 20)**  
± 100  
± 100  
± 50ppm/°C  
A
C
0.20  
0.25  
± 2 Standard  
(± 5%)**  
± 150ppm/°C  
* Tighter tracking available  
** Tolerances in brackets available on request  
TECHNICAL SPECIFICATIONS  
PARAMETER  
UNIT  
MSP SERIES  
Package Power Rating  
See Derating Curves  
(Maximum at + 25°C and + 70°C  
Voltage Coefficient of Resistance  
Dielectric Strength  
Veff  
VAC  
Ω
< 50ppm typical  
200  
Isolation Resistance (03 Schematic)  
Operating Temperature Range  
Storage Temperature Range  
> 100M  
°C  
- 55 to + 125  
- 55 to + 150  
°C  
MECHANICAL SPECIFICATIONS  
Marking Resistance to Solvents:  
Permanency testing per MIL-STD-202, Method 215.  
Per MIL-STD-202, Method 208E, RMA flux.  
Molded epoxy.  
Solderability:  
Body:  
Terminals:  
Weight:  
Copper alloy, tin-lead plated.  
MSP06A = 0.4 gram  
MSP08A = 0.5 gram  
MSP09A = .55 gram  
MSP10A = 0.6 gram  
MSP06C = 0.7 gram  
MSP08C = 0.9 gram  
MSP10C = 1.1 gram  
www.vishay.com  
38  
For Technical Questions, contact: ff2aresistors@vishay.com  
Document Number: 31510  
Revision 25-Oct-00  
1234

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