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MSOP-8 PDF预览

MSOP-8

更新时间: 2024-11-15 10:45:11
品牌 Logo 应用领域
美台 - DIODES /
页数 文件大小 规格书
14页 183K
描述
SUGGESTED PAD LAYOUT

MSOP-8 数据手册

 浏览型号MSOP-8的Datasheet PDF文件第2页浏览型号MSOP-8的Datasheet PDF文件第3页浏览型号MSOP-8的Datasheet PDF文件第4页浏览型号MSOP-8的Datasheet PDF文件第5页浏览型号MSOP-8的Datasheet PDF文件第6页浏览型号MSOP-8的Datasheet PDF文件第7页 
SUGGESTED PAD LAYOUT  
Based on IPC-7351A  
X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC  
C
X
G
Z
Y
X1-DFN1006-2 /  
X2-DFN1006-2  
Dimensions  
MiniMELF  
MELF  
SOD123  
SOD323  
SOD523  
SMA  
SMB  
SMC  
Z
G
X
Y
C
1.1  
0.3  
0.7  
0.4  
0.7  
4.7  
2.1  
1.7  
1.3  
3.5  
6.3  
3.3  
2.7  
1.5  
4.8  
4.9  
2.5  
0.7  
1.2  
3.7  
3.75  
1.05  
0.65  
1.35  
2.40  
2.3  
1.1  
0.8  
0.6  
1.7  
6.5  
1.5  
1.7  
2.5  
4.0  
6.8  
1.8  
2.3  
2.5  
4.3  
9.4  
4.4  
3.3  
2.5  
6.8  
X3-DFN0603-2  
X1-DFN1006-3 / X2-DFN1006-3  
C
Z
Dimensions Value (in mm)  
C
X
1
Z
G1  
G2  
X
1.1  
0.3  
0.2  
0.7  
0.25  
0.4  
0.7  
Dimensions Value (in mm)  
C
X
Y
Z
0.355  
0.230  
0.300  
0.610  
G2  
X
Y (2x)  
X1  
Y
G1  
C
Y
X (2x)  
Z
X1-DFN1212-3  
X
Y
Dimensions  
Value (in mm)  
0.80  
C
X
0.42  
X1  
(2x)  
X1  
Y
0.32  
0.50  
Y2  
Y1  
Y2  
0.50  
1.50  
Y1  
(2x)  
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS  
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.  
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave  
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming  
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.  
AP02001 Rev. 43  
1 of 14  
www.diodes.com  
Suggested Pad Layout  
© Diodes Incorporated  

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