Datasheet > MSCDC150KK70D1PAG-Module

MSCDC150KK70D1PAG-Module

更新时间： 2023-12-06 20:10:50

品牌	Logo	应用领域
美国微芯 - MICROCHIP		/
页数	文件大小	规格书
6页	697K
描述
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switching beha

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MSCDC150KK70D1PAG-Module 数据手册

1.1

Features

The following are key features of the MSCDC150KK70D1PAG device:

Silicon carbide (SiC) Schottky diode

Zero reverse recovery

Zero forward recovery

Temperature-independent switching behavior

Positive temperature coefficient on VF

M5 power connectors

Aluminum nitride (AlN) substrate for improved thermal performance

1.2

1.3

Benefits

The following are benefits of the MSCDC150KK70D1PAG device:

Stable temperature behavior

Low losses

Direct mounting to heatsink (isolated package)

Low junction-to-case thermal resistance

RoHS compliant

Applications

The MSCDC150KK70D1PAG device is designed for the following applications:

Welding converters

Switched mode power supplies

Uninterruptible power supplies

MSCC-0344-DS-01032-1.0-0719 MSCDC150KK70D1PAG Datasheet Revision 1.0

123 4 5 6

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