1N5913BG thru 1N5956BG (Glass)
Axial-Leaded 1.5 Watt Zener Diodes
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
The 1N5913BG-5956BG series of 1.5 watt Zeners provides voltage
regulation in a selection from 3.3 to 200 volts with different tolerances as
identified by suffix letter on the part. These glass encapsulated Zeners with
a G suffix provide hermetic-sealed qualities and higher rated temperature
when required beyond that optionally provided in equivalent plastic-body
constructions (P suffix) for the same JEDEC part numbers. Both package
options are available by Microsemi. A variety of other Zener product
offerings and packages are available by Microsemi to meet higher or lower
power and test-current applications.
DO-41 or
DO-204AL
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
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JEDEC registered 1N5913B to 1N5956B
Zener voltage available 3.3V to 200V
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Regulates voltage over a broad operating current
and temperature range
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Wide selection from 3.3 to 200 V
Flexible axial-lead mounting terminals
Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance in
glass hermetically sealed package
Nonsensitive to ESD
Hermetically sealed glass body construction
Specified capacitance (see Figure 3)
Standard voltage tolerances are plus/minus 5%
with B suffix and 10 % with A suffix identification
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Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
Surface mount equivalents available as SMBJ5913
to SMBJ5956B, SMBG5913 to SMBG5956B, or
MLL5913B to MLL5956B
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Inherently radiation hard as described in Microsemi
MicroNote 050
Plastic body axial-leaded Zener equivalents are
also available as 1N5913BP to 1N5956BP
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
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Power dissipation at 25ºC: 1.5 watts (also see
derating in Figure 1).
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CASE: Hermetically sealed axial-lead glass
package
Operating and Storage temperature: -65ºC to
+175ºC
TERMINALS: Leads, tin-lead plated solderable per
MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
Thermal Resistance: 60 ºC/W junction to lead at
3/8 (10 mm) lead length from body, or 120ºC/W
junction to ambient when mounted on FR4 PC
board (1 oz Cu) with 4 mm2 copper pads and track
width 1 mm, length 25 mm
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MARKING: Part number
TAPE & REEL optional: Standard per EIA-296 (add
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Steady-State Power: 1.5 watts at TL < 85oC 3/8
inch (10 mm) from body, or 1.25 watts at TA = 25ºC
when mounted on FR4 PC board as described for
thermal resistance (also see Figure 1)
“TR” suffix to part number)
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WEIGHT: 0.4 grams
See package dimensions on last page
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Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260 ºC for 10 s (max)
Copyright 2003
Microsemi
Page 1
11-03-2003 REV B
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503