Datasheet > MPX4100AP

MPX4100AP

更新时间： 2024-01-18 18:36:29

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
13页	151K
描述
UNIBODY COMPENSATED

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数据手册

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MPX4100AP 数据手册

Pressure

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

POSITIVE PRESSURE

(P1)

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION -A- IS INCLUSIVE OF THE MOLD

STOP RING. MOLD STOP RING NOT TO EXCEED

16.00 (0.630).

-A-

INCHES

DIM MIN MAX MIN

MILLIMETERS

MAX

16.00

13.56

5.59

0.595

0.630 15.11

0.534 13.06

PIN 1

0.514

0.200

0.027

0.048

SEATING

PLANE

-T-

0.220

0.033

0.064

5.08

0.68

1.22

0.84

1.63

0.100 BSC

2.54 BSC

0.014

0.695

0.016 0.36

0.725 17.65

0.40

18.42

D ^{6 PL}

0.136 (0.005)

30˚ NOM

T A

0.475

0.430

0.090

0.495 12.07

0.450 10.92

12.57

11.43

2.66

0.105

2.29

STYLE 1:

PIN 1. VOUT

2. GROUND

STYLE 2:

PIN 1. OPEN

2. GROUND

STYLE 3:

PIN 1. OPEN

2. GROUND

3. VCC

4. V1

5. V2

3. -VOUT

4. VSUPPLY

5. +VOUT

6. OPEN

3. +VOUT

4. +VSUPPLY

5. -VOUT

6. VEX

6. OPEN

CASE 867-08

ISSUE N

BASIC ELEMENT

MPX4100A

Sensors

Freescale Semiconductor

1...6 7 8910 11 12 13

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与MPX4100AP相关器件

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