是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | LEAD FREE, PLASTIC, BGA-357 | 针数: | 357 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.44 |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 外部数据总线宽度: | 32 |
格式: | FIXED POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B357 | JESD-609代码: | e1 |
长度: | 25 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 357 |
最高工作温度: | 95 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA357,19X19,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 245 |
电源: | 1.8,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 2.52 mm | 速度: | 100 MHz |
子类别: | Microprocessors | 最大供电电压: | 1.9 V |
最小供电电压: | 1.7 V | 标称供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MPC866PZP100A | NXP |
完全替代 |
PowerQUICC, 32 Bit Power Architecture, 100MHz, Communications Processor, 0 to 95C |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC866PVR133A | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC866PVR133A | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture, 133MHz, Communications Processor, 0 to 95C | |
MPC866PZP100 | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC866PZP100A | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC866PZP100A | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture, 100MHz, Communications Processor, 0 to 95C | |
MPC866PZP133 | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC866PZP133A | FREESCALE |
获取价格 |
Hardware Specifications | |
MPC866PZP133A | NXP |
获取价格 |
32-BIT, 133MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
MPC866PZP133A | MOTOROLA |
获取价格 |
32-BIT, 133MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |
MPC866T | FREESCALE |
获取价格 |
Hardware Specifications |