是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 包装说明: | BGA, |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.72 |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 外部数据总线宽度: | 32 |
格式: | FIXED POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B357 | JESD-609代码: | e1 |
长度: | 25 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 357 |
最高工作温度: | 105 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 245 | 座面最大高度: | 2.52 mm |
速度: | 50 MHz | 最大供电电压: | 3.465 V |
最小供电电压: | 3.135 V | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
MPC862TZP100B | NXP | IC,MICROPROCESSOR,32-BIT,BGA,357PIN,PLASTIC |
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MPC862TZP50B | NXP | IC,MICROPROCESSOR,32-BIT,BGA,357PIN,PLASTIC |
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MPC862TZP66B | NXP | IC,MICROPROCESSOR,32-BIT,BGA,357PIN,PLASTIC |
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MPC862TZP80B | NXP | IC,MICROPROCESSOR,32-BIT,BGA,357PIN,PLASTIC |
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MPC8640 | FREESCALE | Integrated Host Processor Hardware Specifications Addendum for the MC8640xTxxyyyyaC Series |
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MPC8640D | FREESCALE | Integrated Host Processor Hardware Specifications Addendum for the MC8640xTxxyyyyaC Series |
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