Datasheet > MPC8270CZUMPD

MPC8270CZUMPD

更新时间： 2024-10-31 18:22:51

品牌	Logo	应用领域
摩托罗拉 - MOTOROLA		/
页数	文件大小	规格书
72页	1234K
描述
Micro Peripheral IC

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技术参数
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MPC8270CZUMPD 技术参数

生命周期：	Obsolete	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.84
Base Number Matches：	1

MPC8270CZUMPD 数据手册

Advance Information

MPC8280EC/D

Rev.0.3, 6/2003

MPC8280

Hardware Speciﬁcations

This document contains detailed information on power considerations, DC/AC electrical

characteristics, and AC timing speciﬁcations for .13µm (HiP7) members of the

PowerQUICC II™ family of integrated communications processors—the MPC8280, the

MPC8275, and the MPC8270 (collectively referred to throughout this document as the

MPC8280).

The following topics are addressed:

Topic

Page

Section 1.1, “Features”

Section 1.2, “Electrical and Thermal Characteristics”

Section 1.2.1, “DC Electrical Characteristics”

Section 1.2.2, “Thermal Characteristics”

Section 1.2.3, “AC Electrical Characteristics”

Section 1.3, “Clock Conﬁguration Modes”

Section 1.3.1, “Local Bus Mode”

Section 1.3.2, “PCI Mode”

Section 1.4, “Pinout”

Section 1.5, “Package Description”

Section 1.6, “Ordering Information”

HiP7 members of the PowerQUICC II family are available in two packages—the standard ZU

package and an alternate VR package—as shown in Table 1. Note that throughout this

document references to the MPC8280 and the MPC8270 are inclusive of VR-package devices

unless otherwise speciﬁed. For more information on VR packages, contact your Motorola

sales ofﬁce.

Table 1. HiP7 PowerQUICC II Device Packages

(480 TBGA)

(516 PBGA)

MPC8280

MPC8270

MPC8275VR

MPC8270VR

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

12 3 4 5 6 7...72

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