FACTSHEET F-202-1
MPAS–144–ZSGT–13
MPAS–068–ZSGT–11
MPAS, MVAS,
MHAS, MSAS
PIN GRID ARRAY SOCKETS
Mates with:
BODY
STYLE
PIN
LEAD PLATING
STYLE OPTION
PIN OUT
OPTION
CODE
MPAT, MVAT, MHAT,
MSAT
COUNT
SPECIFICATIONS
Standard
Polyester
For±complete±specifications
see±www.samtec.com?MPAS
or±www.samtec.com?MVAS
=
GG
–2
MPAS
MVAS
MSAS
= 30µ" (0,76µm)
Gold Contact
10µ" (0,25µm)
Gold Shell
= (9,14).360
Wire-Wrap
(–ZW Only)
–“XXX”
= Total Number
Of Filled
Open
Body Polyester
=
=
MPAS, MVAS
Insulator Material:
Hi-Temp LCP
Open Body
Positions
Black±Glass±Filled
–3
GT
Polyester
= (6,60).260
Wire-Wrap
(–ZW Only)
Operating Temp
= 30µ" (0,76µm)
Gold Contact
200µ" (5,08µm)
Tin Shell
No. of Positions X .100 (2,54) SQ
Range:
-65°C±to±+105°C±with±Tin
-65°C±to±+±125°C±with±Gold
Plating:
(2,54)
.100
Au±over±50µ"±(1,27µm)±Ni±or
Sn±over±100µ"±(2,58µm)±Cu±or
50µ"±(1,27µm)±Ni
–L
= Locking
Socket
TT
Current Rating: 1A
Contact:±BeCu
= 200µ"(5,08µm)
Tin Contact
and Shell
=
Low Profile
MHAS
(–ZS Only)
Shell:±Brass±except±Style±K
Phospher±Bronze
No. of Positions X .100 (2,54) SQ
(Styles –ZS &
ZW Only)
Contact Resistance:
10mΩ±max
(1,27)
.050
Lead Size Range:
.015"±(0,38mm)±to±.022"
(0,56mm)±DIA±except
Style±ZL±=.015"±(0,38mm)±to
.020"±(0,51mm)±DIA;
ZM±=.016"±(0,41mm)±to
.021"±±(0,53mm)±DIA;
ZN±=.016"±(0,41mm)±to
.020"±±(0,51mm)±DIA
Insertion Force:
(7,62)
.300
ST
(3,43)
.135
= 10µ" (5,08µm)
Gold Contact
200µ" (5,08µm)
Tin Shell
Requires±GT
Plating±Option
Note: Some sizes,
styles and options
are non-standard,
non-returnable.
(Style –ZS only)
1.5oz (0,42N) Max Insertion Force
45g (0,44N) Normal Force
Specify Style –ZU
Style±ZU±=±1.5oz±(0,42N)±max,
all±others±=±2.5±oz±(0,69N)
avg,±5.5±oz±(1,53N)±max,
except±Styles±J±&±K±=
9±oz±(2,50N)±avg,±16±oz
(4,45N)±max
Withdrawal Force:
Style±ZU±=±1.5oz±(0,42N)±max,
all±others±2.0±oz±(0,56N)±avg,
0.35±oz±(0,97N)±min±±except
Styles±J±&±K±=±2.5±oz±(0,69N)
avg,±1.5±oz±(0,42N)±min
= Printed
Circuit
= Elevated
= Wire-Wrap
–ZS, –ZU, –ZA, –J, –K
–ZW
–ZE or –ZH
MHAS NOT
AVAILABLE
(0,76)
Locking lead (–L) available.
X
W
Y
Z
OAL
LEAD
LEAD
STYLE
Y
Z
X
.030
DIA
TAIL
STYLE
See OPTION.
TAIL
OAL
DIA
(1,32)
.052
DIA
Shorter w/w
tail lengths
available.
(0,51) (4,32) (8,86) (13,77)
.020 .170 .349 .542
(3,18)
.125
(7,62)
.300
(0,51)
.020
(4,90)
.193
(0,76)
.030
–ZE
–ZH
(0,76)
.030
–ZS, –ZU
–ZA
(0,46) (3,81) (12,95) (17,86)
.018 .150 .510 .703
See OPTION.
(4,57)
.180
(8,89)
.350
(0,51)
.020
(10,41)
.410
(15,24)
.600
(0,64)
.025
Z
(1,32)
.052
DIA
–J
(1,32)
.052
DIA
(12,95)
.510
(17,86)
.703
(0,89)
.035
SPECIFICATIONS
For±complete±specifications
see±www.samtec.com?MSAS
–K
MHAS NOT AVAILABLE
Z
(12,95)
.510
Y
Insertion±Depth±=±.095"±to±.145",
Insertion±Depth
=±.125"±to±.170"
Style±ZE±Component
Part±No.±=±EZ-2P3
Insertion±Depth
=±.125"±to±.145"
Style±ZH±Component
Part±No.±=±EZ-2P2
X
(0,89)
.035
DIA
Style±ZS±Component±Part±No.±=±EZ-1P1
Style±ZA±Component±Part±No.±=±EZ-6P1
Option±L±Component±Part±No.
Insertion±Depth
=±.125"±to±.157"
Y
Style±ZW±Component
Part±No.±=±EZ-1W1(1)
Style±ZW-2±Component
Part±No.±=±EZ-1W1(2)
Style±ZW-3±Component
Part±No.±=±EZ-1W1(3)
=±SC-1L1±or±EZ-1L1
MSAS
Insertion±Depth±=±.095"±to±.138",
Style±J±Component±Part±No.±=±SC-1P3
Insertion±Depth±=±.095"±to±.157",
Style±K±Component±Part±No.±=±SC-2P1
Styles J & K =
16 oz/pin insertion
force
W
Same±as±MPAS
(0,64)
.025
SQ
X
except:
Insulator Material:
Black±Liquid±Crystal±Polymer
Max Processing Temp:
230°C±for±30±to±60±seconds
–ZP orZT= Short
= Low
–ZL Profile
–ZNorZC= Micro
–ZM = PLorowfile
Socket
Tail
LEAD
MHAS & CHAS SERIES ONLY.
LEAD
X
W
Y
Z
W
Z
MHAS &
CHAS
SERIES
ONLY.
STYLE
–ZN
–ZC
DIA HEAD
OAL
W
STYLE
–ZP
–ZT
HEAD OAL
SPECIFICATIONS
For±complete±specifications
see±www.samtec.com?MHAS
(0,76) (0,51) (2,41) (4,83)
.030 .020 .095 .190
(0,76) (5,08)
.030
(0,76)
(0,51)
(3,35)
.020
.200
.030
(3,10)
.122
(1,32)
.052
DIA
Z
(0,74) (0,25) (2,11) (4,19)
.029 .010 .083 .165
(5,33)
.132
(1,32)
.052
DIA
(6,10)
.240
(0,51) (4,24)
.020 .167
.230
± ±.010
(0,25)
(1,32)
.052
DIA
± ±.010
(0,25)
ZN±Insertion±Depth
=.080"±to±.150"
ZN±Component±No
=±EZ-5P1
(0,51)
.020
DIA
(0,89)
.035
Y
Z
MHAS
(0,76)
.030
DIA
W
(0,51)
.020
DIA
Same±as±MPAS
except:
ZP±Insertion±Depth±±=.125"±to±.145"
ZP±Component±No.±=±EZ-1M1
ZT±Insertion±Depth±=±.080"±to±.105"
ZT±Component±No.±=±EZ-1M2
(1,32)
.052
DIA
ZC±Insertion±Depth
=.080"±to±.140"
ZC±Component±No.
=±EZ-8P1
Insertion Depth =.105" to .170"
Component No.= EZ-3P1
Insertion±Depth±=.080"±to±.105"
Component±No.=±EZ-4P1
Insulator Material:
Black±High±Temp.±Plastic
X
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
SAMTEC USA • Tel: 1-800-SAMTEC-9 or 812-944-6733 • Fax: 812-948-5047 SAMTEC UK • Tel: 01236 739292 • Fax: 01236 727113 SAMTEC GERMANY • Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299
SAMTEC FRANCE • Tel: 01 60 95 06 60 • Fax: 01 60 95 06 61 SAMTEC ITALY • Tel: 39 039 6890337 • Fax: 39 039 6890315
SAMTEC ASIA PACIFIC • Tel: 65 6745-5955 • Fax: 65 6841-1502 SAMTEC CHINA • Tel: 86-21-5385-4089 • Fax: 86-21-5385-4047 SAMTEC JAPAN • Tel: 81-424-42-8318 • Fax: 81-424-42-8319
SAMTEC TAIWAN • Tel: (02) 2364-6077 • Fax: (02) 2367-9531 SAMTEC HONG KONG • Tel: 852-26904858 • Fax: 852-26904842
5秒后页面跳转
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
